Anton Prueckl

Person

Schierling, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Laminate electronic device
- Patent number 10,020,245
- Issue date Jul 10, 2018
- Infineon Technologies AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement
- Patent number 9,607,966
- Issue date Mar 28, 2017
- Infineon Technologies AG
- Anton Prueckl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with transistor cells and thermoresistive ele...
- Patent number 9,576,944
- Issue date Feb 21, 2017
- Infineon Technologies AG
- Johannes Georg Laven
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip power semiconductor device
- Patent number 9,443,760
- Issue date Sep 13, 2016
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for manufacturing the same
- Patent number 9,437,548
- Issue date Sep 6, 2016
- Infineon Technologies Austria AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 9,123,687
- Issue date Sep 1, 2015
- Infineon Technologies AG
- Henrik Ewe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Chip package and method for manufacturing the same
- Patent number 9,059,155
- Issue date Jun 16, 2015
- Infineon Technologies Austria AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement and a method for forming a chip arrangement
- Patent number 9,018,773
- Issue date Apr 28, 2015
- Infineon Technologies AG
- Anton Prueckl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip power semiconductor device
- Patent number 8,916,968
- Issue date Dec 23, 2014
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of formation thereof
- Patent number 8,866,274
- Issue date Oct 21, 2014
- Infineon Technologies AG
- Hermann Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including two semiconductor chips and manufacturing thereof
- Patent number 8,866,302
- Issue date Oct 21, 2014
- Infineon Technologies AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement, a method for forming a chip arrangement, a chip p...
- Patent number 8,847,385
- Issue date Sep 30, 2014
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including two semiconductor chips and manufacturing thereof
- Patent number 8,816,504
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate electronic device
- Patent number 8,698,298
- Issue date Apr 15, 2014
- Infineon Technologies AG
- Ewe Henrik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die arrangement and method of forming a die arrangement
- Patent number 8,686,569
- Issue date Apr 1, 2014
- Infineon Technologies AG
- Frank Daeche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a laminate electronic device including sepa...
- Patent number 8,664,043
- Issue date Mar 4, 2014
- Infineon Technologies AG
- Henrik Ewe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip arrangement and a method for forming a chip arrangement
- Patent number 8,648,473
- Issue date Feb 11, 2014
- Infineon Technologies AG
- Anton Prueckl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-package having a cavity and a manufacturing method thereof
- Patent number 8,598,694
- Issue date Dec 3, 2013
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 8,201,326
- Issue date Jun 19, 2012
- Infineon Technologies AG
- Henrik Ewe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Laminate electronic device
- Patent number 8,120,158
- Issue date Feb 21, 2012
- Infineon Technologies AG
- Henrik Ewe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Devices with Transistor Cells and Thermoresistive Ele...
- Publication number 20160163689
- Publication date Jun 9, 2016
- INFINEON TECHNOLOGIES AG
- Johannes Georg Laven
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150279783
- Publication date Oct 1, 2015
- Infineon Technologies Austria AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT
- Publication number 20150255428
- Publication date Sep 10, 2015
- INFINEON TECHNOLOGIES AG
- Anton Prueckl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip Power Semiconductor Device
- Publication number 20150064844
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140264790
- Publication date Sep 18, 2014
- Infineon Technologies Austria AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE ELECTRONIC DEVICE
- Publication number 20140117565
- Publication date May 1, 2014
- INFINEON TECHNOLOGIES AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND A METHOD FOR FORMING A CHIP ARRANGEMENT
- Publication number 20140110864
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Anton Prueckl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENTS AND A METHOD FOR FORMING A CHIP ARRANGEMENT
- Publication number 20130341780
- Publication date Dec 26, 2013
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip Power Semiconductor Device
- Publication number 20130256856
- Publication date Oct 3, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT, A METHOD FOR FORMING A CHIP ARRANGEMENT, A CHIP P...
- Publication number 20130256855
- Publication date Oct 3, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND A METHOD FOR FORMING A CHIP ARRANGEMENT
- Publication number 20130256912
- Publication date Oct 3, 2013
- INFINEON TECHNOLOGIES AG
- Anton Prueckl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Formation Thereof
- Publication number 20130256857
- Publication date Oct 3, 2013
- INFINEON TECHNOLOGIES AG
- Hermann Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-CARRIER, A METHOD FOR FORMING A CHIP-CARRIER AND A METHOD FOR...
- Publication number 20130127031
- Publication date May 23, 2013
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE ELECTRONIC DEVICE
- Publication number 20130010446
- Publication date Jan 10, 2013
- INFINEON TECHNOLOGIES AG
- Ewe Henrik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DE...
- Publication number 20120267774
- Publication date Oct 25, 2012
- INFINEON TECHNOLOGIES AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Including Two Semiconductor Chips and Manufacturing Thereof
- Publication number 20120187565
- Publication date Jul 26, 2012
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ARRANGEMENT AND METHOD OF FORMING A DIE ARRANGEMENT
- Publication number 20120146201
- Publication date Jun 14, 2012
- INFINEON TECHNOLOGIES AG
- Frank Daeche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE ELECTRONIC DEVICE
- Publication number 20110127675
- Publication date Jun 2, 2011
- INFINEON TECHNOLOGIES AG
- Henrik Ewe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE ELECTRONIC DEVICE
- Publication number 20110108971
- Publication date May 12, 2011
- INFINEON TECHNOLOGIES AG
- Henrik Ewe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DE...
- Publication number 20100157568
- Publication date Jun 24, 2010
- INFINEON TECHNOLOGIES AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS

Anton Prueckl

Person

Patents Grantslast 30 patents

Laminate electronic device

Chip arrangement

Semiconductor devices with transistor cells and thermoresistive ele...

Multichip power semiconductor device

Chip package and method for manufacturing the same

Method of manufacturing a semiconductor device

Chip package and method for manufacturing the same

Chip arrangement and a method for forming a chip arrangement

Multichip power semiconductor device

Semiconductor packages and methods of formation thereof

Device including two semiconductor chips and manufacturing thereof

Chip arrangement, a method for forming a chip arrangement, a chip p...

Device including two semiconductor chips and manufacturing thereof

Laminate electronic device

Die arrangement and method of forming a die arrangement

Method of manufacturing a laminate electronic device including sepa...

Chip arrangement and a method for forming a chip arrangement

Chip-package having a cavity and a manufacturing method thereof

Method of manufacturing a semiconductor device

Laminate electronic device

Patents Applicationslast 30 patents

Semiconductor Devices with Transistor Cells and Thermoresistive Ele...

CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME

CHIP ARRANGEMENT

Multichip Power Semiconductor Device

CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME

LAMINATE ELECTRONIC DEVICE

CHIP ARRANGEMENT AND A METHOD FOR FORMING A CHIP ARRANGEMENT

CHIP ARRANGEMENTS AND A METHOD FOR FORMING A CHIP ARRANGEMENT

Multichip Power Semiconductor Device

CHIP ARRANGEMENT, A METHOD FOR FORMING A CHIP ARRANGEMENT, A CHIP P...

CHIP ARRANGEMENT AND A METHOD FOR FORMING A CHIP ARRANGEMENT

Semiconductor Packages and Methods of Formation Thereof

CHIP-CARRIER, A METHOD FOR FORMING A CHIP-CARRIER AND A METHOD FOR...

LAMINATE ELECTRONIC DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DE...

Device Including Two Semiconductor Chips and Manufacturing Thereof

DIE ARRANGEMENT AND METHOD OF FORMING A DIE ARRANGEMENT

LAMINATE ELECTRONIC DEVICE

LAMINATE ELECTRONIC DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DE...