Anton Pugatschow

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Patents Grantslast 30 patents

Information Patent Grant
Solder metallization stack and methods of formation thereof
- Patent number 10,573,611
- Issue date Feb 25, 2020
- Infineon Technologies AG
- Kamil Karlovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded package with chip carrier comprising brazed electrically con...
- Patent number 10,283,432
- Issue date May 7, 2019
- Infineon Technologies AG
- Mark Pavier
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Solder metallization stack and methods of formation thereof
- Patent number 10,115,688
- Issue date Oct 30, 2018
- Infineon Technologies AG
- Kamil Karlovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded package with chip carrier comprising brazed electrically con...
- Patent number 10,074,590
- Issue date Sep 11, 2018
- Infineon Technologies AG
- Mark Pavier
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Solder Metallization Stack and Methods of Formation Thereof
- Publication number 20190051624
- Publication date Feb 14, 2019
- INFINEON TECHNOLOGIES AG
- Kamil Karlovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded package with chip carrier comprising brazed electrically con...
- Publication number 20190006260
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES AG
- Mark PAVIER
- B60 - VEHICLES IN GENERAL
Information Patent Application
Solder Metallization Stack and Methods of Formation Thereof
- Publication number 20160351516
- Publication date Dec 1, 2016
- INFINEON TECHNOLOGIES AG
- Kamil Karlovsky
- H01 - BASIC ELECTRIC ELEMENTS