Anton Schnegg

Person

Burghausen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Process for producing a semiconductor wafer
- Patent number 6,416,393
- Issue date Jul 9, 2002
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Laszlo Fabry
- B24 - GRINDING POLISHING
Information Patent Grant
Adhesive mixture suitable for mounting and demounting a semiconduct...
- Patent number 6,171,385
- Issue date Jan 9, 2001
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Robert Rurlaender
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning agent and method for cleaning semiconductor wafers
- Patent number 5,695,572
- Issue date Dec 9, 1997
- Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Aktiengesellschaft
- Roland Brunner
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Process for the wet-chemical treatment of semiconductor surfaces
- Patent number 5,051,134
- Issue date Sep 24, 1991
- Wacker-Chemitronic Gesellschaft fur Elektronik-Grundstoffe mbH
- Anton Schnegg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for preserving the surface of silicon wafers
- Patent number 4,973,563
- Issue date Nov 27, 1990
- Wacker Chemitronic Gesellschaft
- Helene Prigge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and apparatus for etching semiconductor surfaces
- Patent number 4,971,654
- Issue date Nov 20, 1990
- Wacker-Chemitronic Gesellschaft fur Electronik-Grundstoffe mbH
- Anton Schnegg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of haze-free polishing for semiconductor wafers
- Patent number 4,968,381
- Issue date Nov 6, 1990
- Wacker-Chemitronic Gesellschaft fur Elektronik-Grundstoffe mbH
- Helene Prigge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon wafers for producing oxide layers of high breakdown strengt...
- Patent number 4,954,189
- Issue date Sep 4, 1990
- Wacker-Chemitronic Gesellschaft fur Elektronic-Grundstoffe mbH
- Peter Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the chemical vapor deposition of oxidic particles
- Patent number 4,539,221
- Issue date Sep 3, 1985
- Wacker-Chemitronic Gesellschaft fur Elektronik-Grundstoffe mbH
- Herbert Jacob
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Process for polishing indium phosphide surfaces
- Patent number 4,428,795
- Issue date Jan 31, 1984
- Wacker-Chemitronic Gesellschaft fur Electronik-Grundstoffe mbH
- Franz Kohl
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
Method for assembling planar workpieces
- Publication number 20040029316
- Publication date Feb 12, 2004
- Anton Schnegg
- B24 - GRINDING POLISHING
Information Patent Application
Process for producing a semiconductor wafer
- Publication number 20010036797
- Publication date Nov 1, 2001
- WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AG
- Laszlo Fabry
- B24 - GRINDING POLISHING

Anton Schnegg

Person

Patents Grantslast 30 patents

Process for producing a semiconductor wafer

Adhesive mixture suitable for mounting and demounting a semiconduct...

Cleaning agent and method for cleaning semiconductor wafers

Process for the wet-chemical treatment of semiconductor surfaces

Process for preserving the surface of silicon wafers

Process and apparatus for etching semiconductor surfaces

Method of haze-free polishing for semiconductor wafers

Silicon wafers for producing oxide layers of high breakdown strengt...

Process for the chemical vapor deposition of oxidic particles

Process for polishing indium phosphide surfaces

Patents Applicationslast 30 patents

Method for assembling planar workpieces

Process for producing a semiconductor wafer