Anton-Zoran MIRIC

Person

Alzenau, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing a metal-ceramic substrate
- Patent number 12,059,739
- Issue date Aug 13, 2024
- Heraeus Deutschland GmbH & Co. KG
- Andre Schwöbel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a substrate arrangement, substrate arrangement...
- Patent number 10,622,331
- Issue date Apr 14, 2020
- Heraeus Deutschland GmbH & Co. KG
- Andreas Hinrich
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor module comprising an encapsulating compound that cove...
- Patent number 10,593,608
- Issue date Mar 17, 2020
- Heraeus Deutschland GmbH & Co. KG
- Ronald Eisele
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LAYERED COMPOSITE
- Publication number 20240025148
- Publication date Jan 25, 2024
- Heraeus Deutschland GmbH & Co. KG
- Markus SCHEIBEL
- B32 - LAYERED PRODUCTS
Information Patent Application
PROCESS FOR THE MANUFACTURE OF ENCAPSULATED SEMICONDUCTOR DIES AND/...
- Publication number 20240006191
- Publication date Jan 4, 2024
- Heraeus Materials Singapore Pte. Ltd.
- Markus SCHEIBEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE
- Publication number 20220410299
- Publication date Dec 29, 2022
- Heraeus Deutschland GmbH & Co. KG
- Andre SCHWÖBEL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE AND FURNACE
- Publication number 20220411339
- Publication date Dec 29, 2022
- Heraeus Deutschland GmbH & Co. KG
- Andre SCHWÖBEL
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
LOGIC POWER MODULE WITH A THICK-FILM PASTE MEDIATED SUBSTRATE BONDE...
- Publication number 20200199029
- Publication date Jun 25, 2020
- Heraeus Deutschland GmbH & Co. KG
- Anton Miric
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK-FILM PASTE MEDIATED CERAMICS BONDED WITH METAL OR METAL HYBRI...
- Publication number 20190002359
- Publication date Jan 3, 2019
- Heraeus Deutschland GmbH & Co. KG
- Paul GUNDEL
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR PRODUCING A SUBSTRATE ARRANGEMENT, SUBSTRATE ARRANGEMENT...
- Publication number 20180286831
- Publication date Oct 4, 2018
- Heraeus Deutschland GmbH & Co. KG
- Andreas HINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE COMPRISING AN ENCAPSULATING COMPOUND THAT COVE...
- Publication number 20180261518
- Publication date Sep 13, 2018
- Heraeus Deutschland GmbH & Co. KG
- Ronald EISELE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE COMPRISING AN ENCAPSULATING COMPOUND THAT COVE...
- Publication number 20170133291
- Publication date May 11, 2017
- Heraeus Deutschland GmbH & Co. KG
- Ronald EISELE
- H01 - BASIC ELECTRIC ELEMENTS

Anton-Zoran MIRIC

Person

Patents Grantslast 30 patents

Method for producing a metal-ceramic substrate

Method for producing a substrate arrangement, substrate arrangement...

Semiconductor module comprising an encapsulating compound that cove...

Patents Applicationslast 30 patents

LAYERED COMPOSITE

PROCESS FOR THE MANUFACTURE OF ENCAPSULATED SEMICONDUCTOR DIES AND/...

METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE

METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE AND FURNACE

LOGIC POWER MODULE WITH A THICK-FILM PASTE MEDIATED SUBSTRATE BONDE...

THICK-FILM PASTE MEDIATED CERAMICS BONDED WITH METAL OR METAL HYBRI...

METHOD FOR PRODUCING A SUBSTRATE ARRANGEMENT, SUBSTRATE ARRANGEMENT...

SEMICONDUCTOR MODULE COMPRISING AN ENCAPSULATING COMPOUND THAT COVE...

SEMICONDUCTOR MODULE COMPRISING AN ENCAPSULATING COMPOUND THAT COVE...