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Antonio B. Dimaano, Jr.
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Singapore, SG
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor package system with patterned mask over thermal relief
Patent number
8,274,145
Issue date
Sep 25, 2012
Stats Chippac Ltd.
Leocadio M. Alabin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stackable integrated circuit package system with multiple interconn...
Patent number
8,232,658
Issue date
Jul 31, 2012
Stats Chippac Ltd.
Seng Guan Chow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Quad flat pack in quad flat pack integrated circuit package system...
Patent number
8,178,394
Issue date
May 15, 2012
Stats Chippac Ltd.
Dioscoro A. Merilo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system employing device stacking
Patent number
8,174,127
Issue date
May 8, 2012
Stats Chippac Ltd.
Frederick Rodriguez Dahilig
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system employing device stacking and met...
Patent number
8,120,187
Issue date
Feb 21, 2012
Stats Chippac Ltd.
Frederick Rodriguez Dahilig
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stackable integrated circuit package system
Patent number
8,106,500
Issue date
Jan 31, 2012
Stats Chippac Ltd.
Seng Guan Chow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package on package system
Patent number
7,986,043
Issue date
Jul 26, 2011
Stats Chippac Ltd.
Dioscoro A. Merilo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package in package system
Patent number
7,981,702
Issue date
Jul 19, 2011
Stats Chippac Ltd.
Tsz Yin Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system with interlock
Patent number
7,936,055
Issue date
May 3, 2011
Stats Chippac Ltd.
Antonio B. Dimaano, Jr.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system
Patent number
7,928,540
Issue date
Apr 19, 2011
Stats Chippac Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing integrated circuit package system with warp...
Patent number
7,892,894
Issue date
Feb 22, 2011
Stats Chippac Ltd.
Byung Tai Do
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with etched ring and die paddle...
Patent number
7,863,108
Issue date
Jan 4, 2011
Stats Chippac Ltd.
Antonio B. Dimaano, Jr.
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Integrated circuit package system employing device stacking
Patent number
7,830,020
Issue date
Nov 9, 2010
Stats Chippac Ltd.
Frederick Rodriguez Dahilig
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Quad flat pack in quad flat pack integrated circuit package system
Patent number
7,777,320
Issue date
Aug 17, 2010
Stats Chippac Ltd.
Dioscoro A. Merilo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stackable integrated circuit package system
Patent number
7,741,707
Issue date
Jun 22, 2010
Stats Chippac Ltd.
Seng Guan Chow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating an integrated circuit with etched ring and di...
Patent number
7,556,987
Issue date
Jul 7, 2009
Stats Chippac Ltd.
Antonio B. Dimaano, Jr.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system with stiffener
Patent number
7,545,032
Issue date
Jun 9, 2009
Stats Chippac Ltd.
Henry D. Bathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire sweep resistant semiconductor package and manufacturing method...
Patent number
7,541,222
Issue date
Jun 2, 2009
Stats Chippac Ltd.
Sheila Rima C. Magno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit encapsulation system with vent
Patent number
7,482,683
Issue date
Jan 27, 2009
Stats Chippac Ltd.
Antonio B. Dimaano, Jr.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system with heat sink
Patent number
7,479,692
Issue date
Jan 20, 2009
Stats Chippac Ltd.
Antonio B. Dimaano, Jr.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stackable integrated circuit package system with multiple interconn...
Patent number
7,385,299
Issue date
Jun 10, 2008
Stats Chippac Ltd.
Seng Guan Chow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Air pocket resistant semiconductor package
Patent number
7,141,886
Issue date
Nov 28, 2006
Stats Chippac Ltd.
Antonio B. Dimaano Jr.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Air pocket resistant semiconductor package system
Patent number
6,969,640
Issue date
Nov 29, 2005
Stats Chippac Ltd.
Antonio B. Dimaano Jr.
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
THERMALLY ENHANCED LEADLESS SEMICONDUCTOR PACKAGE AND METHOD OF MAN...
Publication number
20190051585
Publication date
Feb 14, 2019
UTAC Headquarters Pte. Ltd.
Antonio Bambalan DIMAANO JR.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHIELDING
Publication number
20190051614
Publication date
Feb 14, 2019
UTAC Headquarters Pte. Ltd.
Antonio Bambalan DIMAANO JR.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE IN PACKAGE SYSTEM
Publication number
20110248411
Publication date
Oct 13, 2011
Tsz Yin Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING
Publication number
20110147899
Publication date
Jun 23, 2011
Frederick Rodriguez Dahilig
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WARP-FREE CHIP
Publication number
20110121466
Publication date
May 26, 2011
Byung Tai Do
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING AND MET...
Publication number
20110012270
Publication date
Jan 20, 2011
Frederick Rodriguez Dahilig
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
QUAD FLAT PACK IN QUAD FLAT PACK INTEGRATED CIRCUIT PACKAGE SYSTEM...
Publication number
20100264528
Publication date
Oct 21, 2010
Dioscoro A. Merilo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKABLE INTEGRATED CIRCUIT PACKAGE SYSTEM
Publication number
20100219523
Publication date
Sep 2, 2010
Seng Guan Chow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
QUAD FLAT PACK IN QUAD FLAT PACK INTEGRATED CIRCUIT PACKAGE SYSTEM
Publication number
20100072586
Publication date
Mar 25, 2010
Dioscoro A. Merilo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR STRUCTURE
Publication number
20090236726
Publication date
Sep 24, 2009
United Test & Assembly Center Ltd.
Danny RETUTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ETCHED RING AND DIE PADDLE...
Publication number
20090230529
Publication date
Sep 17, 2009
Antonio B. Dimaano, JR.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WARP-FREE CHIP
Publication number
20090079049
Publication date
Mar 26, 2009
Byung Tai Do
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE SYSTEM WITH PATTERNED MASK OVER THERMAL RELIEF
Publication number
20090008768
Publication date
Jan 8, 2009
Leocadio M. Alabin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING
Publication number
20080315411
Publication date
Dec 25, 2008
Frederick Rodriguez Dahilig
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PERIMETER PADDLE
Publication number
20080284038
Publication date
Nov 20, 2008
Antonio B. Dimaano, JR.
H01 - BASIC ELECTRIC ELEMENTS