Aoya Kengo III

Person

Beppu-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Conductive members atop semiconductor packages
- Patent number 12,272,626
- Issue date Apr 8, 2025
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame design in embedded die package
- Patent number 12,154,861
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die packaging with integrated ceramic substrate
- Patent number 12,125,799
- Issue date Oct 22, 2024
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating wirebonded members on package surfaces
- Patent number 12,046,542
- Issue date Jul 23, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with surface contact wire extensions
- Patent number 12,040,260
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an interdigitated mold arrangement
- Patent number 11,942,384
- Issue date Mar 26, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having tapered metal coated sidewalls
- Patent number 11,923,320
- Issue date Mar 5, 2024
- Texas Instruments Incorporated
- Tomoko Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leaded wafer chip scale packages
- Patent number 11,848,244
- Issue date Dec 19, 2023
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter module
- Patent number 11,601,065
- Issue date Mar 7, 2023
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out electronic device
- Patent number 11,410,875
- Issue date Aug 9, 2022
- Texas Instruments Incorporated
- Hau Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package with half-bridge power module
- Patent number 11,387,179
- Issue date Jul 12, 2022
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die packaging with integrated ceramic substrate
- Patent number 11,183,460
- Issue date Nov 23, 2021
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress buffer layer in embedded package
- Patent number 11,183,441
- Issue date Nov 23, 2021
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die package multichip module
- Patent number 11,158,595
- Issue date Oct 26, 2021
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multilayer mold
- Patent number 10,879,144
- Issue date Dec 29, 2020
- Texas Instruments Incorporated
- Kengo Aoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress buffer layer in embedded package
- Patent number 10,580,715
- Issue date Mar 3, 2020
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step sintering of metal paste for semiconductor device wire b...
- Patent number 8,815,648
- Issue date Aug 26, 2014
- Texas Instruments Incorporated
- Kengo Aoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-ball loading device and loading method
- Patent number 8,434,664
- Issue date May 7, 2013
- Texas Instruments Incorporated
- Kengo Aoya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protruding TSV tips for enhanced heat dissipation for IC devices
- Patent number 8,294,261
- Issue date Oct 23, 2012
- Texas Instruments Incorporated
- Kazuaki Mawatari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer mask in micro ball mounter
- Patent number 7,882,625
- Issue date Feb 8, 2011
- Texas Instruments Incoporated
- Kengo Aoya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE MEMBERS ATOP SEMICONDUCTOR PACKAGES
- Publication number 20250201677
- Publication date Jun 19, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR ELECTRONIC DEVICE
- Publication number 20250140626
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH AN INSULATION LAYER
- Publication number 20250112182
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRAME DESIGN IN EMBEDDED DIE PACKAGE
- Publication number 20250087591
- Publication date Mar 13, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS RELIEF SAWN QUAD FLAT NO-LEAD SEMICONDUCTOR PACKAGE
- Publication number 20250038009
- Publication date Jan 30, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Kengo Aoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES
- Publication number 20240379509
- Publication date Nov 14, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES
- Publication number 20240290676
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICES AND METHODS OF MAKING SAME
- Publication number 20240258214
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS
- Publication number 20240213178
- Publication date Jun 27, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Tomoko NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE WITH LOW ASPECT RATIO THROUGH SILICON VIA
- Publication number 20240178164
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MEMBERS ATOP SEMICONDUCTOR PACKAGES
- Publication number 20230275007
- Publication date Aug 31, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER MODULE
- Publication number 20230198422
- Publication date Jun 22, 2023
- TEXAS INSTRUMENTS INCORPORATED
- WOOCHAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN INTERDIGITATED MOLD ARRANGEMENT
- Publication number 20230137762
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADED WAFER CHIP SCALE PACKAGES
- Publication number 20230095630
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER MODULE
- Publication number 20230060830
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- WOOCHAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES
- Publication number 20220352055
- Publication date Nov 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS
- Publication number 20220208689
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Tomoko NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH SURFACE CONTACT WIRE EXTENSIONS
- Publication number 20220208660
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE PACKAGING WITH INTEGRATED CERAMIC SUBSTRATE
- Publication number 20220108955
- Publication date Apr 7, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMERS WITH SEPARATED MAGNETIC MEMBERS
- Publication number 20220068556
- Publication date Mar 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Yi YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH HALF-BRIDGE POWER MODULE
- Publication number 20210175165
- Publication date Jun 10, 2021
- TEXAS INSTRUMENTS INCORPORATED
- MAKOTO SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRAME DESIGN IN EMBEDDED DIE PACKAGE
- Publication number 20210134729
- Publication date May 6, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-COVERED CHIP SCALE PACKAGES
- Publication number 20210125959
- Publication date Apr 29, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu MATSUURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ELECTRONIC DEVICE
- Publication number 20200203219
- Publication date Jun 25, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Hau Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Buffer Layer in Embedded Package
- Publication number 20200203249
- Publication date Jun 25, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE PACKAGING WITH INTEGRATED CERAMIC SUBSTRATE
- Publication number 20200091076
- Publication date Mar 19, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH MULTILAYER MOLD
- Publication number 20200058570
- Publication date Feb 20, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Kengo Aoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Buffer Layer in Embedded Package
- Publication number 20190385924
- Publication date Dec 19, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE PACKAGE MULTICHIP MODULE
- Publication number 20190013288
- Publication date Jan 10, 2019
- WOOCHAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDED EMBEDDED DIE AND FABRICATION OF SAME BACKGROUND
- Publication number 20160240392
- Publication date Aug 18, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS

Aoya Kengo III

Person

Patents Grantslast 30 patents

Conductive members atop semiconductor packages

Frame design in embedded die package

Embedded die packaging with integrated ceramic substrate

Heat-dissipating wirebonded members on package surfaces

Electronic package with surface contact wire extensions

Semiconductor package having an interdigitated mold arrangement

Semiconductor device having tapered metal coated sidewalls

Leaded wafer chip scale packages

Power converter module

Fan-out electronic device

IC package with half-bridge power module

Embedded die packaging with integrated ceramic substrate

Stress buffer layer in embedded package

Embedded die package multichip module

Semiconductor package with multilayer mold

Stress buffer layer in embedded package

Multi-step sintering of metal paste for semiconductor device wire b...

Micro-ball loading device and loading method

Protruding TSV tips for enhanced heat dissipation for IC devices

Transfer mask in micro ball mounter

Patents Applicationslast 30 patents

CONDUCTIVE MEMBERS ATOP SEMICONDUCTOR PACKAGES

SENSOR ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE WITH AN INSULATION LAYER

FRAME DESIGN IN EMBEDDED DIE PACKAGE

STRESS RELIEF SAWN QUAD FLAT NO-LEAD SEMICONDUCTOR PACKAGE

HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES

SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES

PACKAGED ELECTRONIC DEVICES AND METHODS OF MAKING SAME

SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS

SENSOR PACKAGE WITH LOW ASPECT RATIO THROUGH SILICON VIA

CONDUCTIVE MEMBERS ATOP SEMICONDUCTOR PACKAGES

POWER CONVERTER MODULE

SEMICONDUCTOR PACKAGE HAVING AN INTERDIGITATED MOLD ARRANGEMENT

LEADED WAFER CHIP SCALE PACKAGES

POWER CONVERTER MODULE

HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES

SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS

ELECTRONIC PACKAGE WITH SURFACE CONTACT WIRE EXTENSIONS

EMBEDDED DIE PACKAGING WITH INTEGRATED CERAMIC SUBSTRATE

TRANSFORMERS WITH SEPARATED MAGNETIC MEMBERS

IC PACKAGE WITH HALF-BRIDGE POWER MODULE

FRAME DESIGN IN EMBEDDED DIE PACKAGE

METAL-COVERED CHIP SCALE PACKAGES

FAN-OUT ELECTRONIC DEVICE

Stress Buffer Layer in Embedded Package

EMBEDDED DIE PACKAGING WITH INTEGRATED CERAMIC SUBSTRATE

SEMICONDUCTOR PACKAGE WITH MULTILAYER MOLD

Stress Buffer Layer in Embedded Package

EMBEDDED DIE PACKAGE MULTICHIP MODULE

DUAL SIDED EMBEDDED DIE AND FABRICATION OF SAME BACKGROUND