Apama IYER

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Sunnyvale, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Wafer dicing with wide kerf by laser scribing and plasma etching hy...
- Patent number 8,883,614
- Issue date Nov 11, 2014
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND SYSTEM FOR LASER FOCUS PLANE DETERMINATION IN A LASER SC...
- Publication number 20150037915
- Publication date Feb 5, 2015
- Wei-Sheng LEI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR