Aparna IYER

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Proximity contact cover ring for plasma dicing
- Patent number 11,195,756
- Issue date Dec 7, 2021
- Applied Materials, Inc.
- James M. Holden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer arm for film frame substrate handling during plasma singul...
- Patent number 10,692,765
- Issue date Jun 23, 2020
- Applied Materials, Inc.
- James M. Holden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing wafers having solder bumps on wafer backside
- Patent number 9,343,366
- Issue date May 17, 2016
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and carrier for dicing a wafer
- Patent number 9,299,614
- Issue date Mar 29, 2016
- Applied Materials, Inc.
- James M. Holden
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dicing processes for thin wafers with bumps on wafer backside
- Patent number 9,275,902
- Issue date Mar 1, 2016
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing with etch chamber shield ring for film frame wafer app...
- Patent number 9,236,305
- Issue date Jan 12, 2016
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of coating water soluble mask for laser scribing and plasma...
- Patent number 9,177,864
- Issue date Nov 3, 2015
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing method for improving die packaging quality
- Patent number 9,105,710
- Issue date Aug 11, 2015
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pre-patterned dry laminate mask for wafer dicing processes
- Patent number 8,999,816
- Issue date Apr 7, 2015
- Applied Materials, Inc.
- James M. Holden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate dicing by laser ablation and plasma etch damage removal f...
- Patent number 8,980,726
- Issue date Mar 17, 2015
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing from wafer backside
- Patent number 8,975,162
- Issue date Mar 10, 2015
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing using hybrid split-beam laser scribing process with pl...
- Patent number 8,951,819
- Issue date Feb 10, 2015
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of diced wafer transportation
- Patent number 8,940,619
- Issue date Jan 27, 2015
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing wafers having solder bumps on wafer backside
- Patent number 8,912,078
- Issue date Dec 16, 2014
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of coating water soluble mask for laser scribing and plasma...
- Patent number 8,859,397
- Issue date Oct 14, 2014
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TRANSFER ARM FOR FILM FRAME SUBSTRATE HANDLING DURING PLASMA SINGUL...
- Publication number 20200258780
- Publication date Aug 13, 2020
- Applied Materials, Inc.
- James M. Holden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER ARM FOR FILM FRAME SUBSTRATE HANDLING DURING PLASMA SINGUL...
- Publication number 20160133519
- Publication date May 12, 2016
- James M. Holden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY CONTACT COVER RING FOR PLASMA DICING
- Publication number 20160086852
- Publication date Mar 24, 2016
- James M. Holden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING WAFERS HAVING SOLDER BUMPS ON WAFER BACKSIDE
- Publication number 20150303111
- Publication date Oct 22, 2015
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING PROCESSES FOR THIN WAFERS WITH BUMPS ON WAFER BACKSIDE
- Publication number 20150279739
- Publication date Oct 1, 2015
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND CARRIER FOR DICING A WAFER
- Publication number 20150162244
- Publication date Jun 11, 2015
- James M. Holden
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF DICED WAFER TRANSPORTATION
- Publication number 20150102467
- Publication date Apr 16, 2015
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING METHOD FOR IMPROVING DIE PACKAGING QUALITY
- Publication number 20150064878
- Publication date Mar 5, 2015
- Applied Materials, Inc.
- Wei-Sheng LEI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DICING WITH WIDE KERF BY LASER SCRIBING AND PLASMA ETCHING HY...
- Publication number 20150028446
- Publication date Jan 29, 2015
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER SCRIBING AND PLASMA ETCH FOR HIGH DIE BREAK STRENGTH AND SMOO...
- Publication number 20150011073
- Publication date Jan 8, 2015
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF COATING WATER SOLUBLE MASK FOR LASER SCRIBING AND PLASMA...
- Publication number 20140377937
- Publication date Dec 25, 2014
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING WITH WIDE KERF BY LASER SCRIBING AND PLASMA ETCHING HY...
- Publication number 20140346641
- Publication date Nov 27, 2014
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE LASER DICING MASK INCLUDING LASER ENERGY ABSORBING WATER-...
- Publication number 20140273401
- Publication date Sep 18, 2014
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER AND PLASMA ETCH WAFER DICING WITH ETCH CHAMBER SHIELD RING FO...
- Publication number 20140213041
- Publication date Jul 31, 2014
- Wei-Sheng LEI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE DICING BY LASER ABLATION & PLASMA ETCH DAMAGE REMOVAL FOR...
- Publication number 20140213042
- Publication date Jul 31, 2014
- Wei-Sheng LEI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DICING FROM WAFER BACKSIDE
- Publication number 20140179084
- Publication date Jun 26, 2014
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MASK RESIDUE REMOVAL FOR SUBSTRATE DICING BY LASER AND PLASMA ETCH
- Publication number 20140057414
- Publication date Feb 27, 2014
- Aparna IYER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF DICED WAFER TRANSPORTATION
- Publication number 20140015109
- Publication date Jan 16, 2014
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF COATING WATER SOLUBLE MASK FOR LASER SCRIBING AND PLASMA...
- Publication number 20140017882
- Publication date Jan 16, 2014
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING USING HYBRID SPLIT-BEAM LASER SCRIBING PROCESS WITH PL...
- Publication number 20130017668
- Publication date Jan 17, 2013
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Aparna IYER

Person

Patents Grantslast 30 patents

Proximity contact cover ring for plasma dicing

Transfer arm for film frame substrate handling during plasma singul...

Dicing wafers having solder bumps on wafer backside

Method and carrier for dicing a wafer

Dicing processes for thin wafers with bumps on wafer backside

Wafer dicing with etch chamber shield ring for film frame wafer app...

Method of coating water soluble mask for laser scribing and plasma...

Wafer dicing method for improving die packaging quality

Pre-patterned dry laminate mask for wafer dicing processes

Substrate dicing by laser ablation and plasma etch damage removal f...

Wafer dicing from wafer backside

Wafer dicing using hybrid split-beam laser scribing process with pl...

Method of diced wafer transportation

Dicing wafers having solder bumps on wafer backside

Method of coating water soluble mask for laser scribing and plasma...

Patents Applicationslast 30 patents

TRANSFER ARM FOR FILM FRAME SUBSTRATE HANDLING DURING PLASMA SINGUL...

TRANSFER ARM FOR FILM FRAME SUBSTRATE HANDLING DURING PLASMA SINGUL...

PROXIMITY CONTACT COVER RING FOR PLASMA DICING

DICING WAFERS HAVING SOLDER BUMPS ON WAFER BACKSIDE

DICING PROCESSES FOR THIN WAFERS WITH BUMPS ON WAFER BACKSIDE

METHOD AND CARRIER FOR DICING A WAFER

METHOD OF DICED WAFER TRANSPORTATION

WAFER DICING METHOD FOR IMPROVING DIE PACKAGING QUALITY

WAFER DICING WITH WIDE KERF BY LASER SCRIBING AND PLASMA ETCHING HY...

LASER SCRIBING AND PLASMA ETCH FOR HIGH DIE BREAK STRENGTH AND SMOO...

METHOD OF COATING WATER SOLUBLE MASK FOR LASER SCRIBING AND PLASMA...

WAFER DICING WITH WIDE KERF BY LASER SCRIBING AND PLASMA ETCHING HY...

SUBSTRATE LASER DICING MASK INCLUDING LASER ENERGY ABSORBING WATER-...

LASER AND PLASMA ETCH WAFER DICING WITH ETCH CHAMBER SHIELD RING FO...

SUBSTRATE DICING BY LASER ABLATION & PLASMA ETCH DAMAGE REMOVAL FOR...

WAFER DICING FROM WAFER BACKSIDE

MASK RESIDUE REMOVAL FOR SUBSTRATE DICING BY LASER AND PLASMA ETCH

METHOD OF DICED WAFER TRANSPORTATION

METHOD OF COATING WATER SOLUBLE MASK FOR LASER SCRIBING AND PLASMA...

WAFER DICING USING HYBRID SPLIT-BEAM LASER SCRIBING PROCESS WITH PL...