Aparna R. PRASAD

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Photonics packaging platform
- Patent number 11,762,155
- Issue date Sep 19, 2023
- Cisco Technology, Inc.
- Vipulkumar K. Patel
- G02 - OPTICS
Information Patent Grant
Thermal packaging with fan out wafer level processing
- Patent number 11,756,861
- Issue date Sep 12, 2023
- Cisco Technology, Inc.
- Ashley J. M. Erickson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener device providing external connections to co-packaged opti...
- Patent number 11,391,897
- Issue date Jul 19, 2022
- Cisco Technology, Inc.
- Vipulkumar K. Patel
- G02 - OPTICS
Information Patent Grant
Thermal packaging with fan out wafer level processing
- Patent number 11,373,930
- Issue date Jun 28, 2022
- Cisco Technology, Inc.
- Ashley J. M. Erickson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging with substrate and printed circuit board cutouts
- Patent number 11,353,668
- Issue date Jun 7, 2022
- Cisco Technology, Inc.
- Ashley J. M. Erickson
- G02 - OPTICS
Information Patent Grant
Connection features for electronic and optical packaging
- Patent number 11,215,775
- Issue date Jan 4, 2022
- Cisco Technology, Inc.
- Ashley J. Maker
- G02 - OPTICS
Information Patent Grant
Low temperature solder in a photonic device
- Patent number 11,181,689
- Issue date Nov 23, 2021
- Cisco Technology, Inc.
- Sandeep Razdan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Frame lid for in-package optics
- Patent number 11,029,475
- Issue date Jun 8, 2021
- Cisco Technology, Inc.
- Vipulkumar K. Patel
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
LOAD PLATE WITH FEEDTHROUGH
- Publication number 20240304512
- Publication date Sep 12, 2024
- Cisco Technology, Inc.
- Norbert SCHLEPPLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL DAM FOR PHOTONIC PACKAGING
- Publication number 20240272385
- Publication date Aug 15, 2024
- Cisco Technology, Inc.
- Li CHEN
- G02 - OPTICS
Information Patent Application
OPTICAL PACKAGING FEATURES FOR MECHANICAL STABILITY AND OPTICAL FIB...
- Publication number 20240264370
- Publication date Aug 8, 2024
- Cisco Technology, Inc.
- Aparna R. PRASAD
- G02 - OPTICS
Information Patent Application
OPTICAL WAFER-LEVEL PACKAGE
- Publication number 20240184066
- Publication date Jun 6, 2024
- Cisco Technology, Inc.
- Norbert SCHLEPPLE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PHOTONICS PACKAGING PLATFORM
- Publication number 20230060862
- Publication date Mar 2, 2023
- Cisco Technology, Inc.
- Vipulkumar K. PATEL
- G02 - OPTICS
Information Patent Application
THERMAL PACKAGING WITH FAN OUT WAFER LEVEL PROCESSING
- Publication number 20220278022
- Publication date Sep 1, 2022
- Cisco Technology, Inc.
- Ashley J.M. ERICKSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER DEVICE PROVIDING EXTERNAL CONNECTIONS TO CO-PACKAGED OPTI...
- Publication number 20220196933
- Publication date Jun 23, 2022
- Cisco Technology, Inc.
- Vipulkumar K. PATEL
- G02 - OPTICS
Information Patent Application
PACKAGING WITH SUBSTRATE AND PRINTED CIRCUIT BOARD CUTOUTS
- Publication number 20220113480
- Publication date Apr 14, 2022
- Cisco Technology, Inc.
- Ashley J.M. ERICKSON
- G02 - OPTICS
Information Patent Application
THERMAL PACKAGING WITH FAN OUT WAFER LEVEL PROCESSING
- Publication number 20210305128
- Publication date Sep 30, 2021
- Cisco Technology, Inc.
- Ashley J.M. ERICKSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE SOLDER IN A PHOTONIC DEVICE
- Publication number 20210088722
- Publication date Mar 25, 2021
- Cisco Technology, Inc.
- Sandeep RAZDAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION FEATURES FOR ELECTRONIC AND OPTICAL PACKAGING
- Publication number 20210055489
- Publication date Feb 25, 2021
- Cisco Technology, Inc.
- Ashley J. MAKER
- G02 - OPTICS
Information Patent Application
FRAME LID FOR IN-PACKAGE OPTICS
- Publication number 20200319416
- Publication date Oct 8, 2020
- Cisco Technology, Inc.
- Vipulkumar K. PATEL
- G02 - OPTICS

Aparna R. PRASAD

Person

Patents Grantslast 30 patents

Photonics packaging platform

Thermal packaging with fan out wafer level processing

Stiffener device providing external connections to co-packaged opti...

Thermal packaging with fan out wafer level processing

Packaging with substrate and printed circuit board cutouts

Connection features for electronic and optical packaging

Low temperature solder in a photonic device

Frame lid for in-package optics

Patents Applicationslast 30 patents

LOAD PLATE WITH FEEDTHROUGH

UNDERFILL DAM FOR PHOTONIC PACKAGING

OPTICAL PACKAGING FEATURES FOR MECHANICAL STABILITY AND OPTICAL FIB...

OPTICAL WAFER-LEVEL PACKAGE

PHOTONICS PACKAGING PLATFORM

THERMAL PACKAGING WITH FAN OUT WAFER LEVEL PROCESSING

STIFFENER DEVICE PROVIDING EXTERNAL CONNECTIONS TO CO-PACKAGED OPTI...

PACKAGING WITH SUBSTRATE AND PRINTED CIRCUIT BOARD CUTOUTS

THERMAL PACKAGING WITH FAN OUT WAFER LEVEL PROCESSING

LOW TEMPERATURE SOLDER IN A PHOTONIC DEVICE

CONNECTION FEATURES FOR ELECTRONIC AND OPTICAL PACKAGING

FRAME LID FOR IN-PACKAGE OPTICS