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Aparna Ramachandran

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  • Cupertino, CA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Multi-layer full dense mesh
    • Patent number 9,773,727
    • Issue date Sep 26, 2017
    • Oracle International Corporation
    • Duncan C. Collier
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Die power structure
    • Patent number 8,547,167
    • Issue date Oct 1, 2013
    • Oracle International Corporation
    • Aparna Ramachandran
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Die power structure
    • Patent number 8,368,226
    • Issue date Feb 5, 2013
    • Oracle International Corporation
    • Aparna Ramachandran
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    MULTI-LAYER FULL DENSE MESH
    • Publication number 20170092579
    • Publication date Mar 30, 2017
    • ORACLE INTERNATIONAL CORPORATION
    • Duncan C. Collier
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIE POWER STRUCTURE
    • Publication number 20140009219
    • Publication date Jan 9, 2014
    • ORACLE INTERNATIONAL CORPORATION
    • Aparna Ramachandran
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIE POWER STRUCTURE
    • Publication number 20130120054
    • Publication date May 16, 2013
    • ORACLE INTERNATIONAL CORPORATION
    • Aparna Ramachandran
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIE POWER STRUCTURE
    • Publication number 20120161856
    • Publication date Jun 28, 2012
    • Oracle International Corporation
    • Aparna Ramachandran
    • H01 - BASIC ELECTRIC ELEMENTS