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Patents Grants
last 30 patents
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Patent Grant
Method and apparatus for plating a semiconductor package
Patent number
7,922,877
Issue date
Apr 12, 2011
UTAC Thai Limited
Chalermsak Sumithpibul
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method and apparatus for plating a semiconductor package
Patent number
7,718,522
Issue date
May 18, 2010
UTAC Thai Limited
Chalermsak Sumithpibul
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for high speed singulation
Patent number
7,572,168
Issue date
Aug 11, 2009
UTAC Thai Limited
Apichart Phaowongsa
B28 - WORKING CEMENT, CLAY, OR STONE
Patents Applications
last 30 patents
Information
Patent Application
Method and apparatus for plating a semiconductor package
Publication number
20100140081
Publication date
Jun 10, 2010
UTAC Thai Limited
Chalermsak Sumithpibul
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
METHOD AND APPARATUS FOR PLATING A SEMICONDUCTOR PACKAGE
Publication number
20080299756
Publication date
Dec 4, 2008
UTAC Thai Limited
Chalermsak Sumithpibul
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR