Ara Philipossian

Person

Tucson, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and device for the injection of CMP slurry
- Patent number 9,296,088
- Issue date Mar 29, 2016
- Araca Inc.
- Leonard John Borucki
- B24 - GRINDING POLISHING
Information Patent Grant
Method and device for the injection of CMP slurry
- Patent number 8,845,395
- Issue date Sep 30, 2014
- Araca Inc.
- Leonard John Borucki
- B24 - GRINDING POLISHING
Information Patent Grant
Method and device for the injection of CMP slurry
- Patent number 8,197,306
- Issue date Jun 12, 2012
- ARACA, Inc.
- Leonard Borucki
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and method of polishing work piece
- Patent number 7,195,546
- Issue date Mar 27, 2007
- Fujikoshi Machinery Corp.
- Toshiro Doi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and method of polishing work piece
- Patent number 7,070,486
- Issue date Jul 4, 2006
- Toshiro DOY
- Toshiro Doi
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
PAD-IN-A-BOTTLE AND SINGLE PLATEN CHEMICAL MECHANICAL-PLANARIZATION...
- Publication number 20250014911
- Publication date Jan 9, 2025
- VERSUM MATERIALS US, LLC
- XIAOBO SHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PAD-IN-A-BOTTLE CHEMICAL MECHANICAL PLANARIZATION POLISHING WITH CO...
- Publication number 20240425723
- Publication date Dec 26, 2024
- VERSUM MATERIALS US, LLC
- XIAOBO SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL PLANARIZATION SLURRY PROCESSING TECHNIQUES AND...
- Publication number 20240379371
- Publication date Nov 14, 2024
- Ara PHILIPOSSIAN
- B24 - GRINDING POLISHING
Information Patent Application
PAD-IN-A-BOTTLE (PIB) TECHNOLOGY FOR COPPER BARRIER SLURRIES
- Publication number 20240352279
- Publication date Oct 24, 2024
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE (SIC) WAFER POLISHING WITH SLURRY FORMULATION AND P...
- Publication number 20240191101
- Publication date Jun 13, 2024
- Araca Inc.
- Ara Philipossian
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PAD-IN-A-BOTTLE (PIB) TECHNOLOGY FOR COPPER AND THROUGH-SILICON VIA...
- Publication number 20230287242
- Publication date Sep 14, 2023
- VERSUM MATERIALS US, LLC
- XIAOBO SHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD AND DEVICE FOR THE INJECTION OF CMP SLURRY
- Publication number 20140011432
- Publication date Jan 9, 2014
- ARACA, Inc.
- Leonard John Borucki
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND DEVICE FOR THE INJECTION OF CMP SLURRY
- Publication number 20120220206
- Publication date Aug 30, 2012
- ARACA, Inc.
- Leonard John Borucki
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND APPARATUS FOR CHEMICAL-MECHANICAL PLANARIZATION
- Publication number 20110312182
- Publication date Dec 22, 2011
- ARACA, Inc.
- Leonard John Borucki
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF DETERMINING THE LUBRICATION MECHANISM IN CMP
- Publication number 20110076924
- Publication date Mar 31, 2011
- Araca Inc.
- Ara Philipossian
- B24 - GRINDING POLISHING
Information Patent Application
Method of Chemical Mechanical Polishing
- Publication number 20100240283
- Publication date Sep 23, 2010
- ARACA Incorporation
- Takenao Nemoto
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR CMP UNIFORMITY CONTROL
- Publication number 20100216373
- Publication date Aug 26, 2010
- ARACA, Inc.
- Leonard Borucki
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND APPARATUS FOR ACCELERATED WEAR TESTING OF AGGRESSIVE DIA...
- Publication number 20100203811
- Publication date Aug 12, 2010
- ARACA INCORPORATED
- Ara Philipossian
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR COUNTING AND CHARACTERIZING AGGRESSIVE DIAMONDS IN CMP D...
- Publication number 20100186479
- Publication date Jul 29, 2010
- ARACA, Inc.
- Leonard Borucki
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF OBSERVING PATTERN EVOLUTION USING VARIANCE AND FOURIER TR...
- Publication number 20100159804
- Publication date Jun 24, 2010
- ARACA, Inc.
- Yasa Sampurno
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND DEVICE FOR THE INJECTION OF CMP SLURRY
- Publication number 20100112911
- Publication date May 6, 2010
- Leonard Borucki
- B24 - GRINDING POLISHING
Information Patent Application
WAFER HEAD TEMPLATE FOR CHEMICAL MECHANICAL POLISHING AND A METHOD...
- Publication number 20100112905
- Publication date May 6, 2010
- Leonard Borucki
- B24 - GRINDING POLISHING
Information Patent Application
DEVICE FOR DETERMINING THE COEFFICIENT OF FRICTION OF DIAMOND CONDI...
- Publication number 20100107726
- Publication date May 6, 2010
- MITSUBISHI MATERIALS CORPORATION
- Leonard Borucki
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND APPARATUS FOR DETERMINING SHEAR FORCE BETWEEN THE WAFER...
- Publication number 20100099333
- Publication date Apr 22, 2010
- Fransisca Maria Astrid Sudargho
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD OF SEMICONDUCTOR SUBSTRATE
- Publication number 20080200032
- Publication date Aug 21, 2008
- HITACHI CHEMICAL CO., Ltd.
- Toranosuke ASHIZAWA
- B24 - GRINDING POLISHING
Information Patent Application
Polishing apparatus and method of polishing work piece
- Publication number 20060217039
- Publication date Sep 28, 2006
- Toshiro Doi
- Toshiro Doi
- B24 - GRINDING POLISHING
Information Patent Application
Method of conditioning polishing pad for semiconductor wafer
- Publication number 20050164613
- Publication date Jul 28, 2005
- ASAHI SUNAC CORPORATION
- Yoshiyuki Seike
- B24 - GRINDING POLISHING
Information Patent Application
Polishing apparatus and method of polishing work piece
- Publication number 20050113007
- Publication date May 26, 2005
- Fujikoshi Machinery Corp.
- Toshiro Doi
- B24 - GRINDING POLISHING

Ara Philipossian

Person

Patents Grantslast 30 patents

Method and device for the injection of CMP slurry

Method and device for the injection of CMP slurry

Method and device for the injection of CMP slurry

Polishing apparatus and method of polishing work piece

Polishing apparatus and method of polishing work piece

Patents Applicationslast 30 patents

PAD-IN-A-BOTTLE AND SINGLE PLATEN CHEMICAL MECHANICAL-PLANARIZATION...

PAD-IN-A-BOTTLE CHEMICAL MECHANICAL PLANARIZATION POLISHING WITH CO...

CHEMICAL MECHANICAL PLANARIZATION SLURRY PROCESSING TECHNIQUES AND...

PAD-IN-A-BOTTLE (PIB) TECHNOLOGY FOR COPPER BARRIER SLURRIES

SILICON CARBIDE (SIC) WAFER POLISHING WITH SLURRY FORMULATION AND P...

PAD-IN-A-BOTTLE (PIB) TECHNOLOGY FOR COPPER AND THROUGH-SILICON VIA...

METHOD AND DEVICE FOR THE INJECTION OF CMP SLURRY

METHOD AND DEVICE FOR THE INJECTION OF CMP SLURRY

METHOD AND APPARATUS FOR CHEMICAL-MECHANICAL PLANARIZATION

METHOD OF DETERMINING THE LUBRICATION MECHANISM IN CMP

Method of Chemical Mechanical Polishing

METHOD FOR CMP UNIFORMITY CONTROL

METHOD AND APPARATUS FOR ACCELERATED WEAR TESTING OF AGGRESSIVE DIA...

METHOD FOR COUNTING AND CHARACTERIZING AGGRESSIVE DIAMONDS IN CMP D...

METHOD OF OBSERVING PATTERN EVOLUTION USING VARIANCE AND FOURIER TR...

METHOD AND DEVICE FOR THE INJECTION OF CMP SLURRY

WAFER HEAD TEMPLATE FOR CHEMICAL MECHANICAL POLISHING AND A METHOD...

DEVICE FOR DETERMINING THE COEFFICIENT OF FRICTION OF DIAMOND CONDI...

METHOD AND APPARATUS FOR DETERMINING SHEAR FORCE BETWEEN THE WAFER...

POLISHING METHOD OF SEMICONDUCTOR SUBSTRATE

Polishing apparatus and method of polishing work piece

Method of conditioning polishing pad for semiconductor wafer

Polishing apparatus and method of polishing work piece