Arata Okuyama

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Patents Grantslast 30 patents

Information Patent Grant
Memory die containing stress reducing backside contact via structur...
- Patent number 10,804,197
- Issue date Oct 13, 2020
- SanDisk Technologies LLC
- Motoki Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with hydrogen absorption structure
- Patent number 9,640,544
- Issue date May 2, 2017
- SanDisk Technologies LLC
- Arata Okuyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY DIE CONTAINING STRESS REDUCING BACKSIDE CONTACT VIA STRUCTUR...
- Publication number 20200312765
- Publication date Oct 1, 2020
- SANDISK TECHNOLOGIES LLC
- Motoki KAWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH HYDROGEN ABSORPTION STRUCTURE
- Publication number 20160315091
- Publication date Oct 27, 2016
- SanDisk Technologies, Inc.
- Arata Okuyama
- H01 - BASIC ELECTRIC ELEMENTS