Aravindha R. Antoniswamy

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Printed heat spreader structures and methods of providing same
- Patent number 11,923,268
- Issue date Mar 5, 2024
- Intel Corporation
- Jesus Gerardo Reyes Schuldes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vented lids for integrated circuit packages
- Patent number 11,894,282
- Issue date Feb 6, 2024
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
First-level integration of second-level thermal interface material...
- Patent number 11,881,438
- Issue date Jan 23, 2024
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface structures for integrated circuit packages
- Patent number 11,869,824
- Issue date Jan 9, 2024
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid thermal interface material in electronic packaging
- Patent number 11,581,240
- Issue date Feb 14, 2023
- Intel Corporation
- Kedar Dhane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with partial integrated heat spreader
- Patent number 11,004,768
- Issue date May 11, 2021
- Intel Corporation
- Muhammad S. Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreaders with interlocked inserts
- Patent number 10,969,840
- Issue date Apr 6, 2021
- Intel Corporation
- Aravindha R. Antoniswamy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated heat spreader having electromagnetically-formed features
- Patent number 10,763,188
- Issue date Sep 1, 2020
- Intel Corporation
- Aravindha R. Antoniswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreaders with integrated preforms
- Patent number 10,236,233
- Issue date Mar 19, 2019
- Intel Corporation
- Aravindha R. Antoniswamy
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Heat spreaders with integrated preforms
- Patent number 9,799,584
- Issue date Oct 24, 2017
- Intel Corporation
- Aravindha R. Antoniswamy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded air core inductors for integrated circuit package substrat...
- Patent number 9,515,003
- Issue date Dec 6, 2016
- Intel Corporation
- Thomas Fitzgerald
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-component integrated heat spreader for multi-chip packages
- Patent number 9,330,999
- Issue date May 3, 2016
- Intel Corporation
- Thomas J. Fitzgerald
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...
- Publication number 20240222288
- Publication date Jul 4, 2024
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED HEAT SPREADER STRUCTURES AND METHODS OF PROVIDING SAME
- Publication number 20210242105
- Publication date Aug 5, 2021
- Intel Corporation
- Jesus Gerardo Reyes Schuldes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIRST-LEVEL INTEGRATION OF SECOND-LEVEL THERMAL INTERFACE MATERIAL...
- Publication number 20210225729
- Publication date Jul 22, 2021
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20210134698
- Publication date May 6, 2021
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLED LIQUID METAL THERMAL INTERFACE MATERIALS
- Publication number 20210125896
- Publication date Apr 29, 2021
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH PARTIAL INTEGRATED HEAT SPREADER
- Publication number 20210035886
- Publication date Feb 4, 2021
- Intel Corporation
- Muhammad S. Islam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARIABLE-THICKNESS INTEGRATED HEAT SPREADER (IHS)
- Publication number 20210028084
- Publication date Jan 28, 2021
- Intel Corporation
- Sergio Antonio Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HEAT SPREADER (IHS) WITH SOLDER THERMAL INTERFACE MATERI...
- Publication number 20210020537
- Publication date Jan 21, 2021
- Intel Corporation
- Sergio Antonio Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VENTED LIDS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200402884
- Publication date Dec 24, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID THERMAL INTERFACE MATERIAL IN ELECTRONIC PACKAGING
- Publication number 20200203254
- Publication date Jun 25, 2020
- Intel Corporation
- Kedar Dhane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190304805
- Publication date Oct 3, 2019
- Intel Corporation
- Jiongxin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADERS WITH INTERLOCKED INSERTS
- Publication number 20190079567
- Publication date Mar 14, 2019
- Intel Corporation
- Aravindha R. Antoniswamy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SWAGING PROCESS FOR COMPLEX INTEGRATED HEAT SPREADERS
- Publication number 20190043778
- Publication date Feb 7, 2019
- Zhizhong TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERED HEAT SPREADERS WITH INSERTS
- Publication number 20190027379
- Publication date Jan 24, 2019
- Intel Corporation
- Wei Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADERS WITH INTEGRATED PREFORMS
- Publication number 20180012820
- Publication date Jan 11, 2018
- Intel Corporation
- Aravindha R. Antoniswamy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated heat spreader having electromagnetically-formed features
- Publication number 20170186628
- Publication date Jun 29, 2017
- Intel Corporation
- Aravindha R. Antoniswamy
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT SPREADERS WITH INTEGRATED PREFORMS
- Publication number 20170141008
- Publication date May 18, 2017
- Intel Corporation
- Aravindha R. Antoniswamy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-COMPONENT INTEGRATED HEAT SPREADER FOR MULTI-CHIP PACKAGES
- Publication number 20150357258
- Publication date Dec 10, 2015
- Intel Corporation
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS

Aravindha R. Antoniswamy

Person

Patents Grantslast 30 patents

Printed heat spreader structures and methods of providing same

Vented lids for integrated circuit packages

First-level integration of second-level thermal interface material...

Thermal interface structures for integrated circuit packages

Liquid thermal interface material in electronic packaging

Multi-chip package with partial integrated heat spreader

Heat spreaders with interlocked inserts

Integrated heat spreader having electromagnetically-formed features

Heat spreaders with integrated preforms

Heat spreaders with integrated preforms

Embedded air core inductors for integrated circuit package substrat...

Multi-component integrated heat spreader for multi-chip packages

Patents Applicationslast 30 patents

SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...

PRINTED HEAT SPREADER STRUCTURES AND METHODS OF PROVIDING SAME

FIRST-LEVEL INTEGRATION OF SECOND-LEVEL THERMAL INTERFACE MATERIAL...

THERMAL INTERFACE STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES

FILLED LIQUID METAL THERMAL INTERFACE MATERIALS

MULTI-CHIP PACKAGE WITH PARTIAL INTEGRATED HEAT SPREADER

VARIABLE-THICKNESS INTEGRATED HEAT SPREADER (IHS)

INTEGRATED HEAT SPREADER (IHS) WITH SOLDER THERMAL INTERFACE MATERI...

VENTED LIDS FOR INTEGRATED CIRCUIT PACKAGES

LIQUID THERMAL INTERFACE MATERIAL IN ELECTRONIC PACKAGING

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

HEAT SPREADERS WITH INTERLOCKED INSERTS

SWAGING PROCESS FOR COMPLEX INTEGRATED HEAT SPREADERS

SINTERED HEAT SPREADERS WITH INSERTS

HEAT SPREADERS WITH INTEGRATED PREFORMS

Integrated heat spreader having electromagnetically-formed features

HEAT SPREADERS WITH INTEGRATED PREFORMS

MULTI-COMPONENT INTEGRATED HEAT SPREADER FOR MULTI-CHIP PACKAGES