Ardeshir J. Sidhwa

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Scottsdale, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Method and structure of a thick metal layer using multiple depositi...
- Patent number 8,222,138
- Issue date Jul 17, 2012
- ST Microelectronics, Inc.
- Ardeshir J. Sidhwa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Padded clamp ring with edge exclusion for deposition of thick AlCu/...
- Patent number 7,927,424
- Issue date Apr 19, 2011
- STMicroelectronics, Inc.
- Ardeshir Jehangir Sidhwa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and structure of a thick metal layer using multiple depositi...
- Patent number 7,675,174
- Issue date Mar 9, 2010
- STMicroelectronics, Inc.
- Ardeshir J. Sidhwa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Elimination of junction spiking using soft sputter etch and two ste...
- Patent number 6,365,496
- Issue date Apr 2, 2002
- STMicroelectronics, Inc.
- Ardeshir J. Sidhwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for depositing an integrated circuit tungsten film stack tha...
- Patent number 6,265,312
- Issue date Jul 24, 2001
- STMicroelectronics, Inc.
- Ardeshir Jehangir Sidhwa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND STRUCTURE OF A THICK METAL LAYER USING MULTIPLE DEPOSITI...
- Publication number 20100130006
- Publication date May 27, 2010
- STMicroelectronics, Inc.
- Ardeshir J. Sidhwa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Nucleation layer deposition on semiconductor process equipment parts
- Publication number 20070032072
- Publication date Feb 8, 2007
- STMicroelectronics Inc.
- Ardeshir J. Sidhwa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and structure of a thick metal layer using multiple depositi...
- Publication number 20040229458
- Publication date Nov 18, 2004
- STMicroelectronics Inc.
- Ardeshir J. Sidhwa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Padded clamp ring with edge exclusion for deposition of thick AlCu/...
- Publication number 20030196604
- Publication date Oct 23, 2003
- STMicroelectronics, Inc.
- Ardeshir Jehangir Sidhwa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...