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Shanghai, CN
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Patents Grants
last 30 patents
Information
Patent Grant
Method for copper filling of a hole in a component carrier
Patent number
10,455,704
Issue date
Oct 22, 2019
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Ares Wang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Method and Plater Arrangement for Failure-Free Copper Filling of a...
Publication number
20200006135
Publication date
Jan 2, 2020
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Ares Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and Plater Arrangement for Failure-Free Copper Filling of a...
Publication number
20190037703
Publication date
Jan 31, 2019
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Ares Wang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR