Arjun Kar-Roy

Person

Irvine, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Scalable self-supported MEMS structure and related method
- Patent number 9,458,011
- Issue date Oct 4, 2016
- Newport Fab, LLC
- David J. Howard
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Light sensor with chemically resistant and robust reflector stack
- Patent number 9,377,350
- Issue date Jun 28, 2016
- Newport Fab, LLC
- David J. Howard
- G01 - MEASURING TESTING
Information Patent Grant
Robust MEMS structure with via cap and related method
- Patent number 9,346,669
- Issue date May 24, 2016
- Newport Fab, LLC
- David J. Howard
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Deep N wells in triple well structures
- Patent number 9,136,157
- Issue date Sep 15, 2015
- Newport Fab, LLC
- Arjun Kar-Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming deep silicon via for grounding of circuits and d...
- Patent number 9,105,681
- Issue date Aug 11, 2015
- Newport Fab, LLC
- Volker Blaschke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep silicon via for grounding of circuits and devices, emitter bal...
- Patent number 8,598,713
- Issue date Dec 3, 2013
- Newport Fab, LLC
- Volker Blaschke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a backside through-wafer via in a processed...
- Patent number 8,212,331
- Issue date Jul 3, 2012
- Newport Fab, LLC
- Arjun Kar-Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-planarized passivation dielectric for liquid crystal on silico...
- Patent number 8,098,351
- Issue date Jan 17, 2012
- Newport Fab, LLC
- Arjun Kar-Roy
- G02 - OPTICS
Information Patent Grant
Fabricating a top conductive layer in a semiconductor die
- Patent number 7,897,484
- Issue date Mar 1, 2011
- Newport Fab, LLC
- Arjun Kar-Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench isolation and method for forming same
- Patent number 7,772,673
- Issue date Aug 10, 2010
- Newport Fab, LLC
- Kevin Q. Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a frontside through-wafer via in a processed...
- Patent number 7,704,874
- Issue date Apr 27, 2010
- Newport Fab, LLC
- Arjun Kar-Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a top conductive layer in a semiconductor di...
- Patent number 7,589,009
- Issue date Sep 15, 2009
- Newport Fab, LLC
- Arjun Kar-Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a high density composite MIM capacitor with...
- Patent number 7,078,310
- Issue date Jul 18, 2006
- Newport Fab, LLC
- Arjun Kar-Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep N wells in triple well structures and method for fabricating same
- Patent number 7,052,966
- Issue date May 30, 2006
- Newport Fab, LLC
- Arjun Kar-Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a high density composite MIM capacitor with...
- Patent number 7,041,569
- Issue date May 9, 2006
- Newport Fab, LLC
- Arjun Kar-Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a metal resistor in an IC chip and related s...
- Patent number 6,943,414
- Issue date Sep 13, 2005
- Newport Fab, LLC
- Arjun Kar Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density composite MIM capacitor with flexible routing in semic...
- Patent number 6,777,777
- Issue date Aug 17, 2004
- Newport Fab, LLC
- Arjun Kar-Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density composite MIM capacitor with reduced voltage dependenc...
- Patent number 6,680,521
- Issue date Jan 20, 2004
- Newport Fab, LLC
- Arjun Kar-Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density metal insulator metal capacitors
- Patent number 6,459,562
- Issue date Oct 1, 2002
- Conexant Systems, Inc.
- Arjun KarRoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabrication of an MIM capacitor and related structure
- Patent number 6,430,028
- Issue date Aug 6, 2002
- Newport Fab, LLC
- Arjun Kar-Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabrication of an improved capacitor
- Patent number 6,411,492
- Issue date Jun 25, 2002
- Conexant Systems, Inc.
- Arjun Kar-Roy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Structure Having Isolated Deep Substrate Vias With Decreased Pitch...
- Publication number 20180247856
- Publication date Aug 30, 2018
- NEWPORT FAB, LLC DBA JAZZ SEMICONDUCTOR
- Arjun Kar-Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure Having Isolated Deep Substrate Vias With Decreased Pitch...
- Publication number 20170330789
- Publication date Nov 16, 2017
- NEWPORT FAB, LLC DBA JAZZ SEMICONDUCTOR
- Arjun Kar-Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure Having Isolated Deep Substrate Vias with Decreased Pitch...
- Publication number 20160118339
- Publication date Apr 28, 2016
- Newport Fab, LLC dba Jazz Semiconductor.
- Arjun Kar-Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light Sensor with Chemically Resistant and Robust Reflector Stack
- Publication number 20160069739
- Publication date Mar 10, 2016
- Newport Fab, LLC dba Jazz Semiconductor.
- David J. Howard
- G01 - MEASURING TESTING
Information Patent Application
Scalable Self-Supported MEMS Structure and Related Method
- Publication number 20150368092
- Publication date Dec 24, 2015
- NEWPORT FAB, LLC DBA JAZZ SEMICONDUCTOR
- David J. Howard
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Robust MEMS Structure with Via Cap and Related Method
- Publication number 20150368094
- Publication date Dec 24, 2015
- NEWPORT FAB, LLC DBA JAZZ SEMICONDUCTOR
- David J. Howard
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for forming deep silicon via for grounding of circuits and d...
- Publication number 20130109176
- Publication date May 2, 2013
- NEWPORT FAB, LLC DBA JAZZ SEMICONDUCTOR
- Volker Blaschke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deep silicon via for grounding of circuits and devices, emitter bal...
- Publication number 20110018109
- Publication date Jan 27, 2011
- NEWPORT FAB, LLC DBA JAZZ SEMICONDUCTOR
- Volker Blaschke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabricating a Top Conductive Layer in a Semiconductor Die
- Publication number 20090298285
- Publication date Dec 3, 2009
- Newport Fab, LLC dba Jazz Semiconductor.
- Arjun Kar-Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-planarized passivation dielectric for liquid crystal on silico...
- Publication number 20090128768
- Publication date May 21, 2009
- NEWPORT FAB, LLC DBA JAZZ SEMICONDUCTOR
- Arjun Kar-Roy
- G02 - OPTICS
Information Patent Application
Deep N wells in triple well structures and method for fabricating same
- Publication number 20040201065
- Publication date Oct 14, 2004
- Newport Fab,LLC dba Jazz Semiconductor
- Arjun Kar-Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating a metal resistor in an IC chip and related s...
- Publication number 20020132442
- Publication date Sep 19, 2002
- Conexant Systems, Inc.
- Arjun Kar Roy
- H01 - BASIC ELECTRIC ELEMENTS

Arjun Kar-Roy

Person

Patents Grantslast 30 patents

Scalable self-supported MEMS structure and related method

Light sensor with chemically resistant and robust reflector stack

Robust MEMS structure with via cap and related method

Deep N wells in triple well structures

Method for forming deep silicon via for grounding of circuits and d...

Deep silicon via for grounding of circuits and devices, emitter bal...

Method for fabricating a backside through-wafer via in a processed...

Self-planarized passivation dielectric for liquid crystal on silico...

Fabricating a top conductive layer in a semiconductor die

Deep trench isolation and method for forming same

Method for fabricating a frontside through-wafer via in a processed...

Method for fabricating a top conductive layer in a semiconductor di...

Method for fabricating a high density composite MIM capacitor with...

Deep N wells in triple well structures and method for fabricating same

Method for fabricating a high density composite MIM capacitor with...

Method for fabricating a metal resistor in an IC chip and related s...

High density composite MIM capacitor with flexible routing in semic...

High density composite MIM capacitor with reduced voltage dependenc...

High density metal insulator metal capacitors

Method for fabrication of an MIM capacitor and related structure

Structure and method for fabrication of an improved capacitor

Patents Applicationslast 30 patents

Structure Having Isolated Deep Substrate Vias With Decreased Pitch...

Structure Having Isolated Deep Substrate Vias With Decreased Pitch...

Structure Having Isolated Deep Substrate Vias with Decreased Pitch...

Light Sensor with Chemically Resistant and Robust Reflector Stack

Scalable Self-Supported MEMS Structure and Related Method

Robust MEMS Structure with Via Cap and Related Method

Method for forming deep silicon via for grounding of circuits and d...

Deep silicon via for grounding of circuits and devices, emitter bal...

Fabricating a Top Conductive Layer in a Semiconductor Die

Self-planarized passivation dielectric for liquid crystal on silico...

Deep N wells in triple well structures and method for fabricating same

Method for fabricating a metal resistor in an IC chip and related s...