Arjun Krishnan

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of promoting adhesion between underfill and conductive bump...
- Patent number 10,115,606
- Issue date Oct 30, 2018
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener tape for electronic assembly
- Patent number 9,793,151
- Issue date Oct 17, 2017
- Intel Corporation
- Xavier Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold compound with reinforced fibers
- Patent number 9,704,767
- Issue date Jul 11, 2017
- Intel Corporation
- Suriyakala Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust ink formulations for durable markings on microelectronic pac...
- Patent number 9,640,415
- Issue date May 2, 2017
- Intel Corporation
- Randall D. Lowe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming wafer level underfill materials and structures f...
- Patent number 9,631,065
- Issue date Apr 25, 2017
- Intel Corporation
- Anna M. Prakash
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stiffener tape for electronic assembly that includes wafer or panel
- Patent number 9,620,404
- Issue date Apr 11, 2017
- Intel Corporation
- Xavier F. Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Narrow-gap flip chip underfill composition
- Patent number 9,611,372
- Issue date Apr 4, 2017
- Intel Corporation
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of promoting adhesion between underfill and conductive bump...
- Patent number 9,330,993
- Issue date May 3, 2016
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Narrow-gap flip chip underfill composition
- Patent number 9,269,596
- Issue date Feb 23, 2016
- Intel Corporation
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to prevent filler entrapment in microelectronic device to m...
- Patent number 9,230,833
- Issue date Jan 5, 2016
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to prevent filler entrapment in microelectronic device to m...
- Patent number 8,999,765
- Issue date Apr 7, 2015
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust ink formulations for durable markings on microelectronic pac...
- Patent number 8,900,919
- Issue date Dec 2, 2014
- Intel Corporation
- Randall D. Lowe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
ENCAPSULANT MATERIAL CONTAINING FLUOROPHORES FOR IN-SITU VISUALIZAT...
- Publication number 20190393112
- Publication date Dec 26, 2019
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSES AND METHODS FOR APPLYING UNDERFILL TO SINGULATED DIE
- Publication number 20180286704
- Publication date Oct 4, 2018
- Intel Corporation
- Elizabeth M. Nofen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mold compound with reinforced fibers
- Publication number 20170186658
- Publication date Jun 29, 2017
- Intel Corporation
- Suriyakala RAMALINGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMP...
- Publication number 20160240395
- Publication date Aug 18, 2016
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER TAPE FOR ELECTRONIC ASSEMBLY
- Publication number 20160172229
- Publication date Jun 16, 2016
- Intel Corporation
- Xavier Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NARROW-GAP FLIP CHIP UNDERFILL COMPOSITION
- Publication number 20160168351
- Publication date Jun 16, 2016
- Intel Corporation
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NARROW-GAP FLIP CHIP UNDERFILL COMPOSITION
- Publication number 20150179478
- Publication date Jun 25, 2015
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO PREVENT FILLER ENTRAPMENT IN MICROELECTRONIC DEVICE TO M...
- Publication number 20150179479
- Publication date Jun 25, 2015
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROBUST INK FORMULATIONS FOR DURABLE MARKINGS ON MICROELECTRONIC PAC...
- Publication number 20150166804
- Publication date Jun 18, 2015
- Intel Corporation
- Randall D. Lowe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHODS TO PREVENT FILLER ENTRAPMENT IN MICROELECTRONIC DEVICE TO M...
- Publication number 20140377916
- Publication date Dec 25, 2014
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WAFER LEVEL UNDERFILL MATERIALS AND STRUCTURES F...
- Publication number 20140264827
- Publication date Sep 18, 2014
- Anna M. Prakash
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROBUST INK FORMULATIONS FOR DURABLE MARKINGS ON MICROELECTRONIC PAC...
- Publication number 20140264957
- Publication date Sep 18, 2014
- Randall D. Lowe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMP...
- Publication number 20140175634
- Publication date Jun 26, 2014
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOPLASTIC POLYMER COMPOSITIONS WITH PROGRAMMABLE END-OF-LIFE AN...
- Publication number 20130108883
- Publication date May 2, 2013
- EATON CORPORATION
- Arjun Krishnan
- B32 - LAYERED PRODUCTS

Arjun Krishnan

Person

Patents Grantslast 30 patents

Methods of promoting adhesion between underfill and conductive bump...

Stiffener tape for electronic assembly

Mold compound with reinforced fibers

Robust ink formulations for durable markings on microelectronic pac...

Methods of forming wafer level underfill materials and structures f...

Stiffener tape for electronic assembly that includes wafer or panel

Narrow-gap flip chip underfill composition

Methods of promoting adhesion between underfill and conductive bump...

Narrow-gap flip chip underfill composition

Methods to prevent filler entrapment in microelectronic device to m...

Methods to prevent filler entrapment in microelectronic device to m...

Robust ink formulations for durable markings on microelectronic pac...

Patents Applicationslast 30 patents

ENCAPSULANT MATERIAL CONTAINING FLUOROPHORES FOR IN-SITU VISUALIZAT...

PROCESSES AND METHODS FOR APPLYING UNDERFILL TO SINGULATED DIE

Mold compound with reinforced fibers

METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMP...

STIFFENER TAPE FOR ELECTRONIC ASSEMBLY

NARROW-GAP FLIP CHIP UNDERFILL COMPOSITION

NARROW-GAP FLIP CHIP UNDERFILL COMPOSITION

METHODS TO PREVENT FILLER ENTRAPMENT IN MICROELECTRONIC DEVICE TO M...

ROBUST INK FORMULATIONS FOR DURABLE MARKINGS ON MICROELECTRONIC PAC...

METHODS TO PREVENT FILLER ENTRAPMENT IN MICROELECTRONIC DEVICE TO M...

METHODS OF FORMING WAFER LEVEL UNDERFILL MATERIALS AND STRUCTURES F...

ROBUST INK FORMULATIONS FOR DURABLE MARKINGS ON MICROELECTRONIC PAC...

METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMP...

THERMOPLASTIC POLYMER COMPOSITIONS WITH PROGRAMMABLE END-OF-LIFE AN...