Arkalgud Sitaram

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Albany, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods for wet atomic layer etching of copper
- Patent number 11,866,831
- Issue date Jan 9, 2024
- Tokyo Electron Limited
- Christopher Netzband
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ROENTGEN INTEGRATED METROLOGY FOR HYBRID BONDING PROCESS CONTROL IN...
- Publication number 20240387448
- Publication date Nov 21, 2024
- TOKYO ELECTRON LIMITED
- Francisco MACHUCA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES
- Publication number 20240243006
- Publication date Jul 18, 2024
- TOKYO ELECTRON LIMITED
- Scott Lefevre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods For Wet Atomic Layer Etching Of Copper
- Publication number 20230140900
- Publication date May 11, 2023
- TOKYO ELECTRON LIMITED
- Christopher Netzband
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for Etching of Metal
- Publication number 20230108117
- Publication date Apr 6, 2023
- TOKYO ELECTRON LIMITED
- Sergey Voronin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...