Armand Vincent Jereza

Person

Cebu City, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 8,497,164
- Issue date Jul 30, 2013
- Fairchild Semiconductor Corporation
- Armand Vincent C. Jereza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 8,222,718
- Issue date Jul 17, 2012
- Fairchild Semiconductor Corporation
- Armand Vincent C. Jereza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including lead with end portion
- Patent number 8,188,587
- Issue date May 29, 2012
- Fairchild Semiconductor Corporation
- Armand VIncent C. Jereza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded, clip-bonded multi-die semiconductor package
- Patent number 7,898,067
- Issue date Mar 1, 2011
- Fairchild Semiconductor Corporaton
- Armand Vincent C. Jereza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power quad flat no-lead semiconductor die packages with isolated he...
- Patent number 7,816,784
- Issue date Oct 19, 2010
- Fairchild Semiconductor Corporation
- Joon-Seo Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clipless and wireless semiconductor die package and method for maki...
- Patent number 7,371,616
- Issue date May 13, 2008
- Fairchild Semiconductor Corporation
- Armand Vincent C. Jereza
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20120329214
- Publication date Dec 27, 2012
- Armand Vincent C. Jereza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20100193921
- Publication date Aug 5, 2010
- Armand Vincent C. Jereza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER QUAD FLAT NO-LEAD SEMICONDUCTOR DIE PACKAGES WITH ISOLATED HE...
- Publication number 20100148328
- Publication date Jun 17, 2010
- Fairchild Semiconductor Corporation
- Joon-Seo Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLDED, CLIP-BONDED MULTI-DIE SEMICONDUCTOR PACKAGE
- Publication number 20100109134
- Publication date May 6, 2010
- Armand Vincent C. Jereza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING LEAD WITH END PORTION
- Publication number 20100109135
- Publication date May 6, 2010
- Armand Vincent C. Jereza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Packages Having Solder-free Connections, Systems...
- Publication number 20090179315
- Publication date Jul 16, 2009
- Armand Vincent Jereza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Clipless and wireless semiconductor die package and method for maki...
- Publication number 20070155058
- Publication date Jul 5, 2007
- Armand Vincent C. Jereza
- H01 - BASIC ELECTRIC ELEMENTS

Armand Vincent Jereza

Person

Patents Grantslast 30 patents

Semiconductor die package and method for making the same

Semiconductor die package and method for making the same

Semiconductor die package including lead with end portion

Pre-molded, clip-bonded multi-die semiconductor package

Power quad flat no-lead semiconductor die packages with isolated he...

Clipless and wireless semiconductor die package and method for maki...

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

POWER QUAD FLAT NO-LEAD SEMICONDUCTOR DIE PACKAGES WITH ISOLATED HE...

PRE-MOLDED, CLIP-BONDED MULTI-DIE SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DIE PACKAGE INCLUDING LEAD WITH END PORTION

Semiconductor Die Packages Having Solder-free Connections, Systems...

Clipless and wireless semiconductor die package and method for maki...