Armand Vincent JEREZA

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Bucheon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Clip structure and semiconductor package using the same
- Patent number 10,535,589
- Issue date Jan 14, 2020
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor device packages
- Patent number 9,685,398
- Issue date Jun 20, 2017
- Fairchild Semiconductor Corporation
- Margie Rios
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE USING THE SAME
- Publication number 20190019746
- Publication date Jan 17, 2019
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURE
- Publication number 20160284628
- Publication date Sep 29, 2016
- Fairchild Semiconductor Corporation
- Margie RIOS
- H01 - BASIC ELECTRIC ELEMENTS