Armando Tresvalles Clarina JR.

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Baguio City, PH

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Patents Grantslast 30 patents

Information Patent Grant
Packaged semiconductor device with electroplated pillars
- Patent number 12,027,483
- Issue date Jul 2, 2024
- Texas Instruments Incorporated
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with electroplated pillars
- Patent number 11,094,656
- Issue date Aug 17, 2021
- Texas Instruments Incorporated
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a metal barrier
- Patent number 10,797,010
- Issue date Oct 6, 2020
- Texas Instruments Incorporated
- Joel Tomas Medina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having metal bumps with flange
- Patent number 9,564,410
- Issue date Feb 7, 2017
- Texas Instruments Incorporated
- Floro Lopez Camenforte
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH ELECTROPLATED PILLARS
- Publication number 20210375808
- Publication date Dec 2, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH ELECTROPLATED PILLARS
- Publication number 20200211990
- Publication date Jul 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A METAL BARRIER
- Publication number 20190206817
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Joel Tomas MEDINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING METAL BUMPS WITH FLANGE
- Publication number 20170012012
- Publication date Jan 12, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Floro Lopez Camenforte
- H01 - BASIC ELECTRIC ELEMENTS