Arnaud GARNIER

Follow

Person

Grenoble Cedex 09, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing a solder bump on a substrate surface
- Patent number 11,309,269
- Issue date Apr 19, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Arnaud Garnier
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE
- Publication number 20240128227
- Publication date Apr 18, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Perceval COUDRAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SOLDER BUMP ON A SUBSTRATE SURFACE
- Publication number 20210074659
- Publication date Mar 11, 2021
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Arnaud GARNIER
- H01 - BASIC ELECTRIC ELEMENTS