Arno Neidig

Person

Plankstadt, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor component in the planar technique
- Patent number 7,030,426
- Issue date Apr 18, 2006
- IXYS Semiconductor GmbH
- Arno Neidig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module having a plastic housing a metal/ceramic...
- Patent number 5,699,232
- Issue date Dec 16, 1997
- Ixys Semiconductor GmbH
- Arno Neidig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and method for producing the module
- Patent number 4,970,576
- Issue date Nov 13, 1990
- Asea Brown Boveri Aktiengesellschaft
- Arno Neidig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 4,788,626
- Issue date Nov 29, 1988
- Brown, Boveri & Cie AG
- Arno Neidig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and connecting material for the metallic joining of parts
- Patent number 4,746,055
- Issue date May 24, 1988
- Brown, Boveri & Cie AG
- Peter Ingram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module with ceramic substrate
- Patent number 4,731,644
- Issue date Mar 15, 1988
- Brown, Boveri & Cie AG
- Arno Neidig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module with an integrated heat pipe
- Patent number 4,727,455
- Issue date Feb 23, 1988
- Brown, Boveri & Cie AG
- Arno Neidig
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor power module
- Patent number 4,727,454
- Issue date Feb 23, 1988
- Brown Boveri & Cie AG
- Arno Neidig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power thyristor on a substrate
- Patent number 4,672,415
- Issue date Jun 9, 1987
- Brown, Boveri & Cie Aktiengesellschaft
- Gunter Berndes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rectifier module
- Patent number 4,670,771
- Issue date Jun 2, 1987
- Brown, Boveri & Cie AG
- Arno Neidig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power transistor module
- Patent number 4,639,759
- Issue date Jan 27, 1987
- Brown, Boveri & Cie., AG
- Arno Neidig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Static converter module with mounting lugs
- Patent number 4,636,580
- Issue date Jan 13, 1987
- Brown, Boveri & Cie AG
- Arno Neidig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the direct bonding of metal to ceramics
- Patent number 4,591,401
- Issue date May 27, 1986
- Brown, Boveri & Cie Aktiengesellschaft
- Arno Neidig
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method of direct bonding copper foils to oxide-ceramic substrates
- Patent number 4,505,418
- Issue date Mar 19, 1985
- Brown, Boveri & Cie AG
- Arno Neidig
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connecting strap for semiconductor components
- Patent number 4,502,750
- Issue date Mar 5, 1985
- Brown, Boveri & Cie AG
- Arno Neidig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current converter assembly in a flat housing
- Patent number 4,488,167
- Issue date Dec 11, 1984
- Brown, Boveri & Cie AG
- Arno Neidig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for directly joining metal pieces to oxide-ceramic substrates
- Patent number 4,483,810
- Issue date Nov 20, 1984
- Brown, Boveri & Cie AG
- Klaus Bunk
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chemically sensitive field effect transistor having electrode conne...
- Patent number 4,232,326
- Issue date Nov 4, 1980
- BBC Brown, Boveri & Company, Limited
- Arno Neidig
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Power semiconductor component in the planar technique
- Publication number 20050212075
- Publication date Sep 29, 2005
- IXYS Semiconductor GmbH
- Arno Neidig
- H01 - BASIC ELECTRIC ELEMENTS

Arno Neidig

Person

Patents Grantslast 30 patents

Power semiconductor component in the planar technique

Power semiconductor module having a plastic housing a metal/ceramic...

Power semiconductor module and method for producing the module

Power semiconductor module

Method and connecting material for the metallic joining of parts

Semiconductor power module with ceramic substrate

Semiconductor power module with an integrated heat pipe

Semiconductor power module

Power thyristor on a substrate

Rectifier module

Power transistor module

Static converter module with mounting lugs

Process for the direct bonding of metal to ceramics

Method of direct bonding copper foils to oxide-ceramic substrates

Electrical connecting strap for semiconductor components

Current converter assembly in a flat housing

Method for directly joining metal pieces to oxide-ceramic substrates

Chemically sensitive field effect transistor having electrode conne...

Patents Applicationslast 30 patents

Power semiconductor component in the planar technique