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Arnold Daguio
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Gilroy, CA, US
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last 30 patents
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Patent Grant
Bonding ultra-dense bump arrays using alignment bumps
Patent number
11,626,551
Issue date
Apr 11, 2023
Tectus Corporation
Nachiket Raghunath Raravikar
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Robust LED structure for substrate lift-off
Patent number
7,687,810
Issue date
Mar 30, 2010
Philips Lumileds Lighting Company, LLC
Qingwei Mo
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
ROBUST LED STRUCTURE FOR SUBSTRATE LIFT-OFF
Publication number
20090101929
Publication date
Apr 23, 2009
PHILIPS LUMILEDS LIGHTING COMPANY, LLC
Qingwei Mo
H01 - BASIC ELECTRIC ELEMENTS