ARSALAN ALAM

Person

AUSTIN, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stacking power delivery device dies
- Patent number 12,334,488
- Issue date Jun 17, 2025
- Advanced Micro Devices, Inc.
- Arsalan Alam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR EMBEDDING ELECTRONIC COMPONENTS IN SUBSTRATES
- Publication number 20250233087
- Publication date Jul 17, 2025
- ADVANCED MICRO DEVICES, INC.
- Arsalan Alam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE STACK WITH A BRIDGE DIE
- Publication number 20250167192
- Publication date May 22, 2025
- ADVANCED MICRO DEVICES, INC.
- Arsalan ALAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH A THERMAL CARRIER
- Publication number 20250118706
- Publication date Apr 10, 2025
- ADVANCED MICRO DEVICES, INC.
- Manish DUBEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID METHODS AND STRUCTURES FOR INCREASING CAPACITANCE DENSITY IN...
- Publication number 20250098184
- Publication date Mar 20, 2025
- ADVANCED MICRO DEVICES, INC.
- Arsalan Alam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR INCREASING CAPACITANCE DENSITY IN INTEGR...
- Publication number 20250096161
- Publication date Mar 20, 2025
- ADVANCED MICRO DEVICES, INC.
- Arsalan Alam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CONSTRUCTING PACKAGE SUBSTRATES WITH HIGH DENSITY
- Publication number 20240047228
- Publication date Feb 8, 2024
- ADVANCED MICRO DEVICES, INC.
- Sri Ranga Sai Boyapati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKING POWER DELIVERY DEVICE DIES
- Publication number 20230207546
- Publication date Jun 29, 2023
- ADVANCED MICRO DEVICES, INC.
- ARSALAN ALAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING AN INTEGRATED CIRCUIT DIE AND A SUPPORT...
- Publication number 20230197623
- Publication date Jun 22, 2023
- ADVANCED MICRO DEVICES, INC.
- Arsalan Alam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING A SEMICONDUCTOR DIE USING TEMPORARY TEST PADS APPLIED TO CO...
- Publication number 20230120305
- Publication date Apr 20, 2023
- ADVANCED MICRO DEVICES, INC.
- CHIA-HAO CHENG
- H01 - BASIC ELECTRIC ELEMENTS

ARSALAN ALAM

Person

Patents Grantslast 30 patents

Stacking power delivery device dies

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR EMBEDDING ELECTRONIC COMPONENTS IN SUBSTRATES

INTEGRATED CIRCUIT DIE STACK WITH A BRIDGE DIE

CHIP PACKAGE WITH A THERMAL CARRIER

HYBRID METHODS AND STRUCTURES FOR INCREASING CAPACITANCE DENSITY IN...

METHODS AND STRUCTURES FOR INCREASING CAPACITANCE DENSITY IN INTEGR...

METHODS FOR CONSTRUCTING PACKAGE SUBSTRATES WITH HIGH DENSITY

STACKING POWER DELIVERY DEVICE DIES

ELECTRONIC DEVICE INCLUDING AN INTEGRATED CIRCUIT DIE AND A SUPPORT...

TESTING A SEMICONDUCTOR DIE USING TEMPORARY TEST PADS APPLIED TO CO...