Artan Baftiri

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Embedding methods for fine-pitch components and corresponding compo...
- Patent number 12,136,580
- Issue date Nov 5, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier comprising at least two components
- Patent number 12,041,721
- Issue date Jul 16, 2024
- AT&S(Chongqing) Company Limited
- Dominik Wilding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier having component covered with ultra-thin transiti...
- Patent number 11,963,310
- Issue date Apr 16, 2024
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing component carrier and component carrier
- Patent number 11,570,905
- Issue date Jan 31, 2023
- AT&S(Chongqing) Company Limited
- Artan Baftiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress relief opening for reducing warpage of component carriers
- Patent number 11,219,120
- Issue date Jan 4, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with improved toughness factor
- Patent number 10,939,548
- Issue date Mar 2, 2021
- AT&S (China) Co. Ltd.
- Artan Baftiri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Component carrier with improved toughness factor
- Patent number 10,653,009
- Issue date May 12, 2020
- AT&S (China) Co., Ltd.
- Artan Baftiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Component Carrier with Rough Surface and Smooth Surface Metal Trace...
- Publication number 20250081330
- Publication date Mar 6, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Patrick LENHARDT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedding Methods for Fine-Pitch Components and Corresponding Compo...
- Publication number 20250063668
- Publication date Feb 20, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jeesoo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20250054893
- Publication date Feb 13, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Artan BAFTIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier and Method for Manufacturing the Same Using a Des...
- Publication number 20250024611
- Publication date Jan 16, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Nina WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHEET FOR COMPONENT CARRIER COMPRISING SEPARATE STRUCTURES WITH FIL...
- Publication number 20240314927
- Publication date Sep 19, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Nina WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Embedded IC Substrate Inlay, and Manufacturi...
- Publication number 20230245990
- Publication date Aug 3, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Artan Baftiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Connected Component Having Redistribution La...
- Publication number 20230232535
- Publication date Jul 20, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Artan Baftiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Manufacturing a Component Carrier Metal Trace and a Compo...
- Publication number 20230180391
- Publication date Jun 8, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Minwoo LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing Component Carrier With Cavity By Trimming Poorly Adhe...
- Publication number 20230041145
- Publication date Feb 9, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jeffrey JIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedding Methods for Fine-Pitch Components and Corresponding Compo...
- Publication number 20220319943
- Publication date Oct 6, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Gap Around Component Core and Filled With Fi...
- Publication number 20220310428
- Publication date Sep 29, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Artan Baftiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier Comprising at Least Two Components
- Publication number 20220287181
- Publication date Sep 8, 2022
- AT&S (Chongqing) Company Limited
- Dominik WILDING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier Having Component Covered With Ultra-Thin Transiti...
- Publication number 20210227702
- Publication date Jul 22, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Manufacturing Component Carrier and Component Carrier
- Publication number 20210168944
- Publication date Jun 3, 2021
- AT&S (Chongqing) Company Limited
- Artan Baftiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier
- Publication number 20200243436
- Publication date Jul 30, 2020
- AT&S (China) Co. Ltd.
- Artan Baftiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Improved Toughness Factor
- Publication number 20200236781
- Publication date Jul 23, 2020
- AT&S (China) Co. Ltd.
- Artan Baftiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Improved Toughness Factor
- Publication number 20200163211
- Publication date May 21, 2020
- AT&S (China) Co. Ltd.
- Artan Baftiri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Stress Relief Opening for Reducing Warpage of Component Carriers
- Publication number 20200100358
- Publication date Mar 26, 2020
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Artan Baftiri

Person

Patents Grantslast 30 patents

Embedding methods for fine-pitch components and corresponding compo...

Component carrier comprising at least two components

Component carrier having component covered with ultra-thin transiti...

Method of manufacturing component carrier and component carrier

Stress relief opening for reducing warpage of component carriers

Component carrier with improved toughness factor

Component carrier with improved toughness factor

Patents Applicationslast 30 patents

Component Carrier with Rough Surface and Smooth Surface Metal Trace...

Embedding Methods for Fine-Pitch Components and Corresponding Compo...

Component Carrier and Method of Manufacturing the Same

Component Carrier and Method for Manufacturing the Same Using a Des...

SHEET FOR COMPONENT CARRIER COMPRISING SEPARATE STRUCTURES WITH FIL...

Component Carrier With Embedded IC Substrate Inlay, and Manufacturi...

Component Carrier With Connected Component Having Redistribution La...

Method of Manufacturing a Component Carrier Metal Trace and a Compo...

Manufacturing Component Carrier With Cavity By Trimming Poorly Adhe...

Embedding Methods for Fine-Pitch Components and Corresponding Compo...

Component Carrier With Gap Around Component Core and Filled With Fi...

Component Carrier Comprising at Least Two Components

Component Carrier Having Component Covered With Ultra-Thin Transiti...

Method of Manufacturing Component Carrier and Component Carrier

Component Carrier

Component Carrier With Improved Toughness Factor

Component Carrier With Improved Toughness Factor

Stress Relief Opening for Reducing Warpage of Component Carriers