Arturo Urquiza

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Gilbert, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Wafer backside grinding with stress relief
- Patent number 8,222,118
- Issue date Jul 17, 2012
- Intel Corporation
- Mark Dydyk
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wafer Backside Grinding with Stress Relief
- Publication number 20100151678
- Publication date Jun 17, 2010
- Mark Dydyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO DECREASE THIN FILM TENSILE STRESSES RESULTING FROM PHYSIC...
- Publication number 20090124067
- Publication date May 14, 2009
- Intel Corporation
- Andrew N. Contes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...