Arun A. Aiyer

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Optical sensor for surface inspection and metrology
- Patent number 11,703,461
- Issue date Jul 18, 2023
- Arun Anath Aiyer
- G01 - MEASURING TESTING
Information Patent Grant
Optical sensor for surface inspection and metrology
- Patent number 11,561,080
- Issue date Jan 24, 2023
- Arun Anath Aiyer
- G01 - MEASURING TESTING
Information Patent Grant
Optical sensor for surface inspection and metrology
- Patent number 11,442,025
- Issue date Sep 13, 2022
- Arun Anath Aiyer
- G01 - MEASURING TESTING
Information Patent Grant
Sensor device and method for label-free detection of double strand...
- Patent number 10,584,372
- Issue date Mar 10, 2020
- Arun Ananth Aiyer
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Method and system for measuring patterned substrates
- Patent number 9,316,490
- Issue date Apr 19, 2016
- Applejack 199 L.P.
- Arun Ananth Aiyer
- G01 - MEASURING TESTING
Information Patent Grant
Heterodyne reflectometer for film thickness monitoring and method f...
- Patent number 7,339,682
- Issue date Mar 4, 2008
- Verity Instruments, Inc.
- Arun Ananth Aiyer
- G01 - MEASURING TESTING
Information Patent Grant
Non-contact optical profilometer with orthogonal beams
- Patent number 7,084,979
- Issue date Aug 1, 2006
- Verity Instruments, Inc.
- Arun Ananth Aiyer
- G01 - MEASURING TESTING
Information Patent Grant
Alignment simulation
- Patent number 6,988,060
- Issue date Jan 17, 2006
- Nikon Corporation
- Paul Derek Coon
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Wafer inspection apparatus with unique illumination methodology and...
- Patent number 6,768,543
- Issue date Jul 27, 2004
- Arun Ananth Aiyer
- G01 - MEASURING TESTING
Information Patent Grant
In-situ pad conditioning apparatus for CMP polisher
- Patent number 6,733,370
- Issue date May 11, 2004
- Nikon Research Corporation of America
- Arun A. Aiyer
- B24 - GRINDING POLISHING
Information Patent Grant
In-situ pad conditioning for CMP polisher
- Patent number 6,302,770
- Issue date Oct 16, 2001
- Nikon Research Corporation of America
- Arun A. Aiyer
- B24 - GRINDING POLISHING
Information Patent Grant
Heterdoyne Thickness Monitoring System
- Patent number 6,261,152
- Issue date Jul 17, 2001
- Nikon Research Corporation of America
- Arun A. Aiyer
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad thinning to optically access a semiconductor wafer su...
- Patent number 6,248,000
- Issue date Jun 19, 2001
- Nikon Research Corporation of America
- Arun A. Aiyer
- B24 - GRINDING POLISHING
Information Patent Grant
Thin film detection method and apparatus
- Patent number 5,936,254
- Issue date Aug 10, 1999
- Nikon Research Corporation of America
- Arun A. Aiyer
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for macro defect detection using scattered light
- Patent number 5,859,698
- Issue date Jan 12, 1999
- Nikon Corporation
- Henry K. Chau
- G01 - MEASURING TESTING
Information Patent Grant
CMP variable angle in situ sensor
- Patent number 5,838,448
- Issue date Nov 17, 1998
- Nikon Corporation
- Arun A. Aiyer
- G01 - MEASURING TESTING
Information Patent Grant
Wafer inspection method and apparatus using diffracted light
- Patent number 5,777,729
- Issue date Jul 7, 1998
- Nikon Corporation
- Arun A. Aiyer
- G01 - MEASURING TESTING
Information Patent Grant
Film thickness measurement apparatus with tilting stage and method...
- Patent number 5,729,343
- Issue date Mar 17, 1998
- Nikon Precision Inc.
- Arun A. Aiyer
- G01 - MEASURING TESTING
Information Patent Grant
Technique for detecting particles on a wafer support surface
- Patent number 5,698,069
- Issue date Dec 16, 1997
- Nikon Precision Inc.
- Arun A. Aiyer
- G01 - MEASURING TESTING
Information Patent Grant
Beam delivery apparatus and method for interferometry using rotatab...
- Patent number 5,648,848
- Issue date Jul 15, 1997
- Nikon Precision, Inc.
- Arun A. Aiyer
- G02 - OPTICS
Information Patent Grant
Illumination source and method for microlithography
- Patent number 5,453,814
- Issue date Sep 26, 1995
- Nikon Precision Inc.
- Arun A. Aiyer
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL SENSOR FOR SURFACE INSPECTION AND METROLOGY
- Publication number 20220381550
- Publication date Dec 1, 2022
- Arun Anath AIYER
- G01 - MEASURING TESTING
Information Patent Application
OPTICAL SENSOR FOR SURFACE INSPECTION AND METROLOGY
- Publication number 20220381702
- Publication date Dec 1, 2022
- Arun Anath AIYER
- G01 - MEASURING TESTING
Information Patent Application
OPTICAL SENSOR FOR SURFACE INSPECTION AND METROLOGY
- Publication number 20220307992
- Publication date Sep 29, 2022
- Arun Anath AIYER
- G01 - MEASURING TESTING
Information Patent Application
INTERFEROMETER
- Publication number 20160334205
- Publication date Nov 17, 2016
- Applejack 199 L.P.
- ARUN ANANTH AIYER
- G01 - MEASURING TESTING
Information Patent Application
STRESS ANALYSIS OF SEMICONDUCTOR WAFERS
- Publication number 20150323313
- Publication date Nov 12, 2015
- Applejack 199 L.P.
- ARUN ANANTH AIYER
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND SYSTEM FOR MEASURING PATTERNED SUBSTRATES
- Publication number 20140233016
- Publication date Aug 21, 2014
- APPLEJACK 199 L,P.,
- Arun Ananth Aiyer
- G01 - MEASURING TESTING
Information Patent Application
Method for monitoring film thickness using heterodyne reflectometry...
- Publication number 20060285120
- Publication date Dec 21, 2006
- Verity Instruments, Inc.
- Arun Ananth Aiyer
- G01 - MEASURING TESTING
Information Patent Application
Heterodyne reflectomer for film thickness monitoring and method for...
- Publication number 20060192973
- Publication date Aug 31, 2006
- Verity Instruments, Inc.
- Arun Ananth Aiyer
- G01 - MEASURING TESTING
Information Patent Application
Automated overlay metrology system
- Publication number 20020192577
- Publication date Dec 19, 2002
- Bernard Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-situ pad conditoning apparatus for CMP polisher
- Publication number 20010039171
- Publication date Nov 8, 2001
- Arun A. Aiyer
- B24 - GRINDING POLISHING

Arun A. Aiyer

Person

Patents Grantslast 30 patents

Optical sensor for surface inspection and metrology

Optical sensor for surface inspection and metrology

Optical sensor for surface inspection and metrology

Sensor device and method for label-free detection of double strand...

Method and system for measuring patterned substrates

Heterodyne reflectometer for film thickness monitoring and method f...

Non-contact optical profilometer with orthogonal beams

Alignment simulation

Wafer inspection apparatus with unique illumination methodology and...

In-situ pad conditioning apparatus for CMP polisher

In-situ pad conditioning for CMP polisher

Heterdoyne Thickness Monitoring System

Polishing pad thinning to optically access a semiconductor wafer su...

Thin film detection method and apparatus

Method and apparatus for macro defect detection using scattered light

CMP variable angle in situ sensor

Wafer inspection method and apparatus using diffracted light

Film thickness measurement apparatus with tilting stage and method...

Technique for detecting particles on a wafer support surface

Beam delivery apparatus and method for interferometry using rotatab...

Illumination source and method for microlithography

Patents Applicationslast 30 patents

OPTICAL SENSOR FOR SURFACE INSPECTION AND METROLOGY

OPTICAL SENSOR FOR SURFACE INSPECTION AND METROLOGY

OPTICAL SENSOR FOR SURFACE INSPECTION AND METROLOGY

INTERFEROMETER

STRESS ANALYSIS OF SEMICONDUCTOR WAFERS

METHOD AND SYSTEM FOR MEASURING PATTERNED SUBSTRATES

Method for monitoring film thickness using heterodyne reflectometry...

Heterodyne reflectomer for film thickness monitoring and method for...

Automated overlay metrology system

In-situ pad conditoning apparatus for CMP polisher