Arun K. Chaudhuri

Person

Carmel, IN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dendritic polyol, cycloaliphatic epoxy resin and cationic initiator
- Patent number 7,754,824
- Issue date Jul 13, 2010
- Delphi Technologies, Inc.
- Rafil A. Basheer
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermal transient suppression material and method of production
- Patent number 7,498,376
- Issue date Mar 3, 2009
- Delphi Technologies, Inc.
- Bruce A. Myers
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Optical information processing circuit assembly
- Patent number 7,324,715
- Issue date Jan 29, 2008
- Delphi Technologies, Inc.
- Tecktiong Tan
- G02 - OPTICS
Information Patent Grant
Enhancement of underfill physical properties by the addition of the...
- Patent number 7,119,449
- Issue date Oct 10, 2006
- Delphi Technologies, Inc.
- Derek B. Workman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No-flow underfill process and material therefor
- Patent number 6,943,058
- Issue date Sep 13, 2005
- Delphi Technologies, Inc.
- Arun K. Chaudhuri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wafer-applied underfill process
- Patent number 6,916,684
- Issue date Jul 12, 2005
- Delphi Technologies, Inc.
- Frank Stepniak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally-conductive electrically-insulating polymer-base material
- Patent number 6,822,018
- Issue date Nov 23, 2004
- Delphi Technologies, Inc.
- Arun K. Chaudhuri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Conductive adhesive material with metallurgically-bonded conductive...
- Patent number 6,802,446
- Issue date Oct 12, 2004
- Delphi Technologies, Inc.
- Arun K. Chaudhuri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermally-capacitive phase change encapsulant for electronic devices
- Patent number 6,703,128
- Issue date Mar 9, 2004
- Delphi Technologies, Inc.
- Bruce A. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No-flow underfill material and underfill method for flip chip devices
- Patent number 6,660,560
- Issue date Dec 9, 2003
- Delphi Technologies, Inc.
- Arun K. Chaudhuri
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYPERBRANCHED POLYMER AND CYCLOALIPHATIC EPOXY RESIN THERMOSETS
- Publication number 20090082528
- Publication date Mar 26, 2009
- Rafil A. Basheer
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Hyperbranched polymer and cycloaliphatic epoxy resin thermosets
- Publication number 20060252892
- Publication date Nov 9, 2006
- Rafil A. Basheer
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Underfill method
- Publication number 20060200985
- Publication date Sep 14, 2006
- DELPHI TECHNOLOGIES, INC.
- Derek B. Workman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of making a curable composition having low coefficient of t...
- Publication number 20060199301
- Publication date Sep 7, 2006
- Rafil A. Basheer
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermal transient suppression material and method of production
- Publication number 20050287352
- Publication date Dec 29, 2005
- Bruce A. Myers
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Thermally-conductive electrically-insulating polymer-base material
- Publication number 20050137286
- Publication date Jun 23, 2005
- DELPHI TECHNOLOGIES, INC.
- Arun K. Chaudhuri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Enhancement of underfill physical properties by the addition of a t...
- Publication number 20050122697
- Publication date Jun 9, 2005
- Derek B. Workman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Underfill method
- Publication number 20050014313
- Publication date Jan 20, 2005
- Derek B. Workman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
No-flow underfill process and material therefor
- Publication number 20040185602
- Publication date Sep 23, 2004
- Delphi Technologies, Inc.
- Arun K. Chaudhuri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Wafer-applied underfill process
- Publication number 20040185601
- Publication date Sep 23, 2004
- Frank Stepniak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical information processing circuit assembly
- Publication number 20040114851
- Publication date Jun 17, 2004
- Tecktiong Tan
- G02 - OPTICS
Information Patent Application
Thermally-capacitive phase change encapsulant for electronic devices
- Publication number 20030157342
- Publication date Aug 21, 2003
- Bruce A. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally-conductive electrically-insulating polymer-base material
- Publication number 20030158294
- Publication date Aug 21, 2003
- Arun K. Chaudhuri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Conductive adhesive material with metallurgically-bonded conductive...
- Publication number 20030146266
- Publication date Aug 7, 2003
- Arun K. Chaudhuri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
No-flow underfill material and underfill method for flip chip devices
- Publication number 20030049411
- Publication date Mar 13, 2003
- DELPHI TECHNOLOGIES,INC
- Arun K. Chaudhuri
- B32 - LAYERED PRODUCTS

Arun K. Chaudhuri

Person

Patents Grantslast 30 patents

Dendritic polyol, cycloaliphatic epoxy resin and cationic initiator

Thermal transient suppression material and method of production

Optical information processing circuit assembly

Enhancement of underfill physical properties by the addition of the...

No-flow underfill process and material therefor

Wafer-applied underfill process

Thermally-conductive electrically-insulating polymer-base material

Conductive adhesive material with metallurgically-bonded conductive...

Thermally-capacitive phase change encapsulant for electronic devices

No-flow underfill material and underfill method for flip chip devices

Patents Applicationslast 30 patents

HYPERBRANCHED POLYMER AND CYCLOALIPHATIC EPOXY RESIN THERMOSETS

Hyperbranched polymer and cycloaliphatic epoxy resin thermosets

Underfill method

Methods of making a curable composition having low coefficient of t...

Thermal transient suppression material and method of production

Thermally-conductive electrically-insulating polymer-base material

Enhancement of underfill physical properties by the addition of a t...

Underfill method

No-flow underfill process and material therefor

Wafer-applied underfill process

Optical information processing circuit assembly

Thermally-capacitive phase change encapsulant for electronic devices

Thermally-conductive electrically-insulating polymer-base material

Conductive adhesive material with metallurgically-bonded conductive...

No-flow underfill material and underfill method for flip chip devices