Arun Kumar C. NALLANI

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Controlled solder height packages and assembly processes
- Patent number 9,960,105
- Issue date May 1, 2018
- Intel Corporation
- Hongin Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid solder and filled paste in microelectronic packaging
- Patent number 8,920,934
- Issue date Dec 30, 2014
- Intel Corporation
- Hongjin Jiang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
HYBRID SOLDER AND FILLED PASTE IN MICROELECTRONIC PACKAGING
- Publication number 20140291843
- Publication date Oct 2, 2014
- Hongjin Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE/HIGH TEMPERATURE SOLDER HYBRID SOLDER INTERCONNECTS
- Publication number 20140151096
- Publication date Jun 5, 2014
- Hongjin Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLED SOLDER HEIGHT PACKAGES AND ASSEMBLY PROCESSES
- Publication number 20140091457
- Publication date Apr 3, 2014
- Hongjin JIANG
- H01 - BASIC ELECTRIC ELEMENTS