Arun RAMAKRISHNAN

Person

Irvine, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cantilevered power planes to provide a return current path for high...
- Patent number 12,191,243
- Issue date Jan 7, 2025
- Avago Technologies International Sales Pte. Limited
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics integration in semiconductor packages
- Patent number 11,906,802
- Issue date Feb 20, 2024
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- G02 - OPTICS
Information Patent Grant
Hexagonally arranged connection patterns for high-density device pa...
- Patent number 10,971,450
- Issue date Apr 6, 2021
- Avago Technologies International Sales Pte. Limited
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection patterns for high-density device packaging
- Patent number 9,824,978
- Issue date Nov 21, 2017
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball arrangement for integrated circuit package devices
- Patent number 9,431,361
- Issue date Aug 30, 2016
- Broadcom Corporation
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball arrangement for integrated circuit package devices
- Patent number 8,975,746
- Issue date Mar 10, 2015
- Broadcom Corporation
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES
- Publication number 20240339429
- Publication date Oct 10, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonics Integration in Semiconductor Packages
- Publication number 20240151921
- Publication date May 9, 2024
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- G02 - OPTICS
Information Patent Application
Substrate with Differing Dielectric Constants
- Publication number 20240145392
- Publication date May 2, 2024
- Avago Technologies International Sales Pte. Limited
- Dharmendra Saraswat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microfluidic Channels for Cooling Hybrid Bonded Interfaces
- Publication number 20240128156
- Publication date Apr 18, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge Seal for Bonded Stacks of Different Size Semiconductor Devices
- Publication number 20240038613
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elastomer Interconnection Substrate Layer
- Publication number 20240038641
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Dharmendra Saraswat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Interconnection Structure
- Publication number 20240038645
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Side Wall Interconnection
- Publication number 20240038724
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Antennas on Side Wall of 3D Stacked Die
- Publication number 20240039141
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mixed Dielectric Materials for Improving Signal Integrity of Integr...
- Publication number 20230395444
- Publication date Dec 7, 2023
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packaging Heterogeneous Area Array Interconnections
- Publication number 20230369267
- Publication date Nov 16, 2023
- Avago Technologies International Sales Pte. Limited
- Sam Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonics Integration in Semiconductor Packages
- Publication number 20230367087
- Publication date Nov 16, 2023
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- G02 - OPTICS
Information Patent Application
Cantilevered Power Planes to Provide a Return Current Path for High...
- Publication number 20230369191
- Publication date Nov 16, 2023
- Avago Technologies International Sales Pte. Limited
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Cores, Variable Width Vias, and Offset Vias
- Publication number 20230352383
- Publication date Nov 2, 2023
- Avago Technologies International Sales Pte. Limited
- Dharmendra Saraswat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEXAGONALLY ARRANGED CONNECTION PATTERNS FOR HIGH-DENSITY DEVICE PA...
- Publication number 20200235052
- Publication date Jul 23, 2020
- Avago Technologies International Sales Pte. Limited
- Arun RAMAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connection Patterns for High-Density Device Packaging
- Publication number 20170033054
- Publication date Feb 2, 2017
- BROADCOM CORPORATION
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL ARRANGEMENT FOR INTEGRATED CIRCUIT PACKAGE DEVICES
- Publication number 20150145132
- Publication date May 28, 2015
- BROADCOM CORPORATION
- Arun RAMAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL ARRANGEMENT FOR INTEGRATED CIRCUIT PACKAGE DEVICES
- Publication number 20150061128
- Publication date Mar 5, 2015
- BROADCOM CORPORATION
- Arun RAMAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS

Arun RAMAKRISHNAN

Person

Patents Grantslast 30 patents

Cantilevered power planes to provide a return current path for high...

Photonics integration in semiconductor packages

Hexagonally arranged connection patterns for high-density device pa...

Connection patterns for high-density device packaging

Ball arrangement for integrated circuit package devices

Ball arrangement for integrated circuit package devices

Patents Applicationslast 30 patents

PACKAGING SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES

Photonics Integration in Semiconductor Packages

Substrate with Differing Dielectric Constants

Microfluidic Channels for Cooling Hybrid Bonded Interfaces

Edge Seal for Bonded Stacks of Different Size Semiconductor Devices

Elastomer Interconnection Substrate Layer

Semiconductor Package Interconnection Structure

Semiconductor Package with Side Wall Interconnection

Integrated Antennas on Side Wall of 3D Stacked Die

Mixed Dielectric Materials for Improving Signal Integrity of Integr...

3D Packaging Heterogeneous Area Array Interconnections

Photonics Integration in Semiconductor Packages

Cantilevered Power Planes to Provide a Return Current Path for High...

Multilayer Cores, Variable Width Vias, and Offset Vias

HEXAGONALLY ARRANGED CONNECTION PATTERNS FOR HIGH-DENSITY DEVICE PA...

Connection Patterns for High-Density Device Packaging

BALL ARRANGEMENT FOR INTEGRATED CIRCUIT PACKAGE DEVICES

BALL ARRANGEMENT FOR INTEGRATED CIRCUIT PACKAGE DEVICES