Arvin Nono VERDEFLOR

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Allen, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Embedded lid for low cost and improved thermal performance
- Patent number 12,021,004
- Issue date Jun 25, 2024
- Texas Instruments Incorporated
- Hiep Xuan Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging
- Patent number 11,227,852
- Issue date Jan 18, 2022
- Texas Instruments Incorporated
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging
- Patent number 10,629,562
- Issue date Apr 21, 2020
- Texas Instruments Incorporated
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED LID FOR LOW COST AND IMPROVED THERMAL PERFORMANCE
- Publication number 20220319950
- Publication date Oct 6, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Hiep Xuan Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING
- Publication number 20200251440
- Publication date Aug 6, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Honglin GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING
- Publication number 20190206828
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Honglin GUO
- H01 - BASIC ELECTRIC ELEMENTS