Arvind Shrivastava

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Pune, IN

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Patents Grantslast 30 patents

Information Patent Grant
On-die programming of integrated circuit bond pads
- Patent number 8,841,746
- Issue date Sep 23, 2014
- LSI Corporation
- Akhilesh Rathi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
On-Die Programming of Integrated Circuit Bond Pads
- Publication number 20140240033
- Publication date Aug 28, 2014
- LSI Corporation
- Akhilesh Rathi
- H01 - BASIC ELECTRIC ELEMENTS