Membership
Tour
Register
Log in
Asahi NOMOTO
Follow
Person
Tokyo, JP
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Separation method of wafer
Patent number
11,901,231
Issue date
Feb 13, 2024
Disco Corporation
Asahi Nomoto
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Processed wafer and method of manufacturing chip formation wafer
Patent number
11,881,407
Issue date
Jan 23, 2024
Denso Corporation
Masatake Nagaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Diamond substrate producing method
Patent number
10,950,462
Issue date
Mar 16, 2021
Disco Corporation
Asahi Nomoto
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MANUFACTURING METHOD OF GALLIUM NITRIDE SUBSTRATE
Publication number
20240149379
Publication date
May 9, 2024
Disco Corporation
Asahi NOMOTO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MANUFACTURING METHOD OF SUBSTRATE
Publication number
20240009773
Publication date
Jan 11, 2024
Disco Corporation
Asahi NOMOTO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MANUFACTURING METHOD OF WAFER
Publication number
20230398640
Publication date
Dec 14, 2023
Disco Corporation
Asahi NOMOTO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WAFER MANUFACTURING METHOD
Publication number
20230321871
Publication date
Oct 12, 2023
Disco Corporation
Kazuya HIRATA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PROCESSING METHOD AND PROCESSING APPARATUS FOR INGOT
Publication number
20220395931
Publication date
Dec 15, 2022
Disco Corporation
Asahi NOMOTO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PROCESSED WAFER AND METHOD OF MANUFACTURING CHIP FORMATION WAFER
Publication number
20220130675
Publication date
Apr 28, 2022
DENSO CORPORATION
Masatake NAGAYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEPARATION METHOD OF WAFER
Publication number
20220102213
Publication date
Mar 31, 2022
Disco Corporation
Asahi NOMOTO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WAFER PRODUCTION METHOD
Publication number
20210323098
Publication date
Oct 21, 2021
Disco Corporation
Asahi NOMOTO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DIAMOND SUBSTRATE PRODUCING METHOD
Publication number
20200105543
Publication date
Apr 2, 2020
Disco Corporation
Asahi NOMOTO
H01 - BASIC ELECTRIC ELEMENTS