Asao Nishimura

Person

Koganel, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Pb-free solder-connected structure
- Patent number 8,907,475
- Issue date Dec 9, 2014
- Renesas Electronics Corporation
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 8,629,481
- Issue date Jan 14, 2014
- Renesas Electronics Corporation
- Asao Nishimura
- G01 - MEASURING TESTING
Information Patent Grant
Pb-free solder-connected structure and electronic device
- Patent number 8,503,189
- Issue date Aug 6, 2013
- Renesas Electronics Corporation
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor integrated circuit device with a fuse circuit
- Patent number 7,910,960
- Issue date Mar 22, 2011
- Renesas Electronics Corporation
- Asao Nishimura
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor integrated circuit device and manufacture thereof
- Patent number 7,910,922
- Issue date Mar 22, 2011
- Renesas Electronics Corporation
- Asao Nishimura
- G01 - MEASURING TESTING
Information Patent Grant
Pb-free solder-connected structure and electronic device
- Patent number 7,709,746
- Issue date May 4, 2010
- Renesas Technology Corp.
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor integrated circuit device and manufacture thereof
- Patent number 7,550,763
- Issue date Jun 23, 2009
- Renesas Technology Corp.
- Asao Nishimura
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,420,284
- Issue date Sep 2, 2008
- Renesas Technology Corp.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module
- Patent number 7,388,295
- Issue date Jun 17, 2008
- Renesas Technology Corp.
- Atsushi Kazama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,378,333
- Issue date May 27, 2008
- Renesas Technology Corp.
- Toshiya Satoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device having particular testing p...
- Patent number 7,247,879
- Issue date Jul 24, 2007
- Renesas Technology Corp.
- Asao Nishimura
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device, semiconductor wafer, semiconductor module, an...
- Patent number 7,217,992
- Issue date May 15, 2007
- Renesas Technology Corp.
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,138,722
- Issue date Nov 21, 2006
- Renesas Technology Corp.
- Toshio Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,119,446
- Issue date Oct 10, 2006
- Hitachi, Ltd.
- Hiroya Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory-Module with an increased density for mounting semiconductor...
- Patent number 7,102,221
- Issue date Sep 5, 2006
- Hitachi, Ltd.
- Toshio Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,091,620
- Issue date Aug 15, 2006
- Renesas Technology Corp.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 7,057,283
- Issue date Jun 6, 2006
- Hitachi, Ltd.
- Kosuke Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module
- Patent number 7,038,322
- Issue date May 2, 2006
- Hitachi, Ltd.
- Atsushi Kazama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring tape for semiconductor device including a buffer layer havin...
- Patent number 7,038,325
- Issue date May 2, 2006
- Hitachi Cable, Ltd.
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,030,478
- Issue date Apr 18, 2006
- Renesas Technology Corp.
- Hiroya Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing an electronic device having a PB free solder co...
- Patent number 7,013,564
- Issue date Mar 21, 2006
- Hitachi, Ltd.
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pb-free solder-connected structure and electronic device
- Patent number 6,960,396
- Issue date Nov 1, 2005
- Hitachi, Ltd.
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor integrated circuit device
- Patent number 6,949,416
- Issue date Sep 27, 2005
- Renesas Technology Corp.
- Toshio Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,946,723
- Issue date Sep 20, 2005
- Renesas Technology Corp.
- Toshiya Satoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of that
- Patent number 6,946,327
- Issue date Sep 20, 2005
- Renesas Technology Corp.
- Toshio Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and mounting method for same
- Patent number 6,940,162
- Issue date Sep 6, 2005
- Renesas Technology Corp.
- Shuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same and semi...
- Patent number 6,930,388
- Issue date Aug 16, 2005
- Renesas Technology Corp.
- Yoshihide Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device provided with rewiring layer
- Patent number 6,927,489
- Issue date Aug 9, 2005
- Renesas Technology Corp.
- Akihiro Yaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,919,622
- Issue date Jul 19, 2005
- Renesas Technology Corp.
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING PLURAL SEMICO...
- Patent number 6,900,074
- Issue date May 31, 2005
- Renesas Technology Corp.
- Toshio Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Pb-FREE SOLDER-CONNECTED STRUCTURE
- Publication number 20130286621
- Publication date Oct 31, 2013
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURE THEREOF
- Publication number 20110140185
- Publication date Jun 16, 2011
- RENESAS ELECTRONICS CORPORATION
- Asao Nishimura
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURE THEREOF
- Publication number 20100301334
- Publication date Dec 2, 2010
- RENESAS ELECTRONICS CORPORATION
- Asao Nishimura
- G01 - MEASURING TESTING
Information Patent Application
Pb-free solder-connected structure and electronic device
- Publication number 20100214753
- Publication date Aug 26, 2010
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURE THEREOF
- Publication number 20090230448
- Publication date Sep 17, 2009
- Renesas Technology Corp.
- Asao Nishimura
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor integrated circuit device and manufacture thereof
- Publication number 20070241330
- Publication date Oct 18, 2007
- Asao Nishimura
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20060261494
- Publication date Nov 23, 2006
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060125078
- Publication date Jun 15, 2006
- Hiroya Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip module
- Publication number 20060125116
- Publication date Jun 15, 2006
- Atsushi Kazama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pb-free solder-connected structure and electronic device
- Publication number 20060115994
- Publication date Jun 1, 2006
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050245061
- Publication date Nov 3, 2005
- Toshiya Satoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing metthod thereof
- Publication number 20050212142
- Publication date Sep 29, 2005
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050200019
- Publication date Sep 15, 2005
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050184391
- Publication date Aug 25, 2005
- Hiroya Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050146008
- Publication date Jul 7, 2005
- RENESAS TECHNOLOGY CORP.
- Toshio Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip module
- Publication number 20050029674
- Publication date Feb 10, 2005
- Atsushi Kazama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050006751
- Publication date Jan 13, 2005
- Hiroya Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module and mounting method for same
- Publication number 20040251540
- Publication date Dec 16, 2004
- Shuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device and manufacture thereof
- Publication number 20040232446
- Publication date Nov 25, 2004
- RENESAS TECHNOLOGY CORPORATION
- Asao Nishimura
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor integrated circuit device and method of manufacturing...
- Publication number 20040227254
- Publication date Nov 18, 2004
- Toshio Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, semiconductor wafer, semiconductor module, an...
- Publication number 20040217453
- Publication date Nov 4, 2004
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for producing the same
- Publication number 20040195687
- Publication date Oct 7, 2004
- Kosuke Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring tape for semiconductor device including a buffer layer havin...
- Publication number 20040195702
- Publication date Oct 7, 2004
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of that
- Publication number 20040155351
- Publication date Aug 12, 2004
- RENESAS TECHNOLOGY CORPORATION
- Toshio Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20040155323
- Publication date Aug 12, 2004
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-CHIP MODULE
- Publication number 20040108579
- Publication date Jun 10, 2004
- Atsushi Kazama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20040061220
- Publication date Apr 1, 2004
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030209740
- Publication date Nov 13, 2003
- Hitachi, Ltd.
- Toshio Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20030207557
- Publication date Nov 6, 2003
- Yukiharu Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20030127747
- Publication date Jul 10, 2003
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Asao Nishimura

Person

Patents Grantslast 30 patents

Pb-free solder-connected structure

Semiconductor integrated circuit device

Pb-free solder-connected structure and electronic device

Semiconductor integrated circuit device with a fuse circuit

Semiconductor integrated circuit device and manufacture thereof

Pb-free solder-connected structure and electronic device

Semiconductor integrated circuit device and manufacture thereof

Semiconductor device and manufacturing method thereof

Multi-chip module

Semiconductor device and manufacturing method thereof

Semiconductor integrated circuit device having particular testing p...

Semiconductor device, semiconductor wafer, semiconductor module, an...

Semiconductor device

Semiconductor device

Memory-Module with an increased density for mounting semiconductor...

Semiconductor device and manufacturing method thereof

Semiconductor device and method for producing the same

Multi-chip module

Wiring tape for semiconductor device including a buffer layer havin...

Semiconductor device

Method of producing an electronic device having a PB free solder co...

Pb-free solder-connected structure and electronic device

Method of manufacturing a semiconductor integrated circuit device

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method of that

Semiconductor module and mounting method for same

Semiconductor device and method for manufacturing the same and semi...

Semiconductor device provided with rewiring layer

Semiconductor device

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING PLURAL SEMICO...

Patents Applicationslast 30 patents

Pb-FREE SOLDER-CONNECTED STRUCTURE

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURE THEREOF

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURE THEREOF

Pb-free solder-connected structure and electronic device

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURE THEREOF

Semiconductor integrated circuit device and manufacture thereof

Semiconductor device and manufacturing method thereof

Semiconductor device

Multi-chip module

Pb-free solder-connected structure and electronic device

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing metthod thereof

Semiconductor device and manufacturing method thereof

Semiconductor device

Semiconductor device

Multi-chip module

Semiconductor device

Semiconductor module and mounting method for same

Semiconductor integrated circuit device and manufacture thereof

Semiconductor integrated circuit device and method of manufacturing...

Semiconductor device, semiconductor wafer, semiconductor module, an...

Semiconductor device and method for producing the same

Wiring tape for semiconductor device including a buffer layer havin...

Semiconductor device and manufacturing method of that

Semiconductor device

MULTI-CHIP MODULE

Semiconductor device and manufacturing method thereof

Semiconductor device

Semiconductor device and its manufacturing method

Semiconductor device and manufacturing method thereof