Ashley J.M. ERICKSON

Person

Danville, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Solder reflow compatible connections between optical components
- Patent number 12,044,884
- Issue date Jul 23, 2024
- Cisco Technology, Inc.
- Matthew J. Traverso
- G02 - OPTICS
Information Patent Grant
Thermal packaging with fan out wafer level processing
- Patent number 11,756,861
- Issue date Sep 12, 2023
- Cisco Technology, Inc.
- Ashley J. M. Erickson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Periscope optical assembly with inserted components
- Patent number 11,668,875
- Issue date Jun 6, 2023
- Cisco Technology, Inc.
- Ashley J. M. Erickson
- G02 - OPTICS
Information Patent Grant
Thermal packaging with fan out wafer level processing
- Patent number 11,373,930
- Issue date Jun 28, 2022
- Cisco Technology, Inc.
- Ashley J. M. Erickson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging with substrate and printed circuit board cutouts
- Patent number 11,353,668
- Issue date Jun 7, 2022
- Cisco Technology, Inc.
- Ashley J. M. Erickson
- G02 - OPTICS
Information Patent Grant
Integration of power and optics through cold plate for delivery to...
- Patent number 11,320,610
- Issue date May 3, 2022
- Cisco Technology, Inc.
- Joel Richard Goergen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow compatible connections between optical components
- Patent number 11,300,728
- Issue date Apr 12, 2022
- Cisco Technology, Inc.
- Matthew J. Traverso
- G02 - OPTICS
Information Patent Grant
Power distribution from point-of-load with cooling
- Patent number 11,252,811
- Issue date Feb 15, 2022
- Cisco Technology, Inc.
- Joel Richard Goergen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PERISCOPE OPTICAL ASSEMBLY WITH INSERTED COMPONENTS
- Publication number 20230244035
- Publication date Aug 3, 2023
- Cisco Technology, Inc.
- Ashley J.M. ERICKSON
- G02 - OPTICS
Information Patent Application
THERMAL PACKAGING WITH FAN OUT WAFER LEVEL PROCESSING
- Publication number 20220278022
- Publication date Sep 1, 2022
- Cisco Technology, Inc.
- Ashley J.M. ERICKSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW COMPATIBLE CONNECTIONS BETWEEN OPTICAL COMPONENTS
- Publication number 20220187537
- Publication date Jun 16, 2022
- Cisco Technology, Inc.
- Matthew J. TRAVERSO
- G02 - OPTICS
Information Patent Application
PACKAGING WITH SUBSTRATE AND PRINTED CIRCUIT BOARD CUTOUTS
- Publication number 20220113480
- Publication date Apr 14, 2022
- Cisco Technology, Inc.
- Ashley J.M. ERICKSON
- G02 - OPTICS
Information Patent Application
INTEGRATION OF POWER AND OPTICS THROUGH COLD PLATE FOR DELIVERY TO...
- Publication number 20210311269
- Publication date Oct 7, 2021
- Cisco Technology, Inc.
- Joel Richard Goergen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PACKAGING WITH FAN OUT WAFER LEVEL PROCESSING
- Publication number 20210305128
- Publication date Sep 30, 2021
- Cisco Technology, Inc.
- Ashley J.M. ERICKSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERISCOPE OPTICAL ASSEMBLY WITH INSERTED COMPONENTS
- Publication number 20210302715
- Publication date Sep 30, 2021
- Cisco Technology, Inc.
- Ashley J.M. ERICKSON
- G02 - OPTICS
Information Patent Application
SOLDER REFLOW COMPATIBLE CONNECTIONS BETWEEN OPTICAL COMPONENTS
- Publication number 20210247569
- Publication date Aug 12, 2021
- Cisco Technology, Inc.
- Matthew J. TRAVERSO
- G02 - OPTICS
Information Patent Application
POWER DISTRIBUTION FROM POINT-OF-LOAD WITH COOLING
- Publication number 20210219415
- Publication date Jul 15, 2021
- Cisco Technology, Inc.
- Joel Richard Goergen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT FEATURES FOR FIBER TO CHIP ALIGNMENT
- Publication number 20210080662
- Publication date Mar 18, 2021
- Cisco Technology, Inc.
- Ashley J.M. ERICKSON
- G02 - OPTICS

Ashley J.M. ERICKSON

Person

Patents Grantslast 30 patents

Solder reflow compatible connections between optical components

Thermal packaging with fan out wafer level processing

Periscope optical assembly with inserted components

Thermal packaging with fan out wafer level processing

Packaging with substrate and printed circuit board cutouts

Integration of power and optics through cold plate for delivery to...

Solder reflow compatible connections between optical components

Power distribution from point-of-load with cooling

Patents Applicationslast 30 patents

PERISCOPE OPTICAL ASSEMBLY WITH INSERTED COMPONENTS

THERMAL PACKAGING WITH FAN OUT WAFER LEVEL PROCESSING

SOLDER REFLOW COMPATIBLE CONNECTIONS BETWEEN OPTICAL COMPONENTS

PACKAGING WITH SUBSTRATE AND PRINTED CIRCUIT BOARD CUTOUTS

INTEGRATION OF POWER AND OPTICS THROUGH COLD PLATE FOR DELIVERY TO...

THERMAL PACKAGING WITH FAN OUT WAFER LEVEL PROCESSING

PERISCOPE OPTICAL ASSEMBLY WITH INSERTED COMPONENTS

SOLDER REFLOW COMPATIBLE CONNECTIONS BETWEEN OPTICAL COMPONENTS

POWER DISTRIBUTION FROM POINT-OF-LOAD WITH COOLING

ALIGNMENT FEATURES FOR FIBER TO CHIP ALIGNMENT