Ashok N. Kabadi

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Test, validation, and debug architecture
- Patent number 10,198,333
- Issue date Feb 5, 2019
- Intel Corporation
- Mark B. Trobough
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Removable package underside device attach
- Patent number 7,729,121
- Issue date Jun 1, 2010
- Intel Corporation
- Anand Deshpande
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid compression socket connector for integrated circuits
- Patent number 7,177,142
- Issue date Feb 13, 2007
- Intel Corporation
- Ashok N. Kabadi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component array adapter
- Patent number 6,529,385
- Issue date Mar 4, 2003
- Intel Corporation
- Gary W. Brady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Parallel-plate/pin-fin hybrid copper heat sink for cooling high-pow...
- Patent number 6,269,864
- Issue date Aug 7, 2001
- Intel Corporation
- Ashok N. Kabadi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Direct BGA socket
- Patent number 6,097,609
- Issue date Aug 1, 2000
- Intel Corporation
- Ashok N. Kabadi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection device for connecting test equipment with a circuit...
- Patent number 5,594,356
- Issue date Jan 14, 1997
- Intel Corporation
- Leonard Turner
- G01 - MEASURING TESTING
Information Patent Grant
Interconnection device for connecting test equipment with a circuit...
- Patent number 5,418,469
- Issue date May 23, 1995
- Intel Corporation
- Leonard Turner
- G01 - MEASURING TESTING
Information Patent Grant
High density connector system
- Patent number 5,057,023
- Issue date Oct 15, 1991
- Intel Corporation
- Ashok N. Kabadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density connection system
- Patent number 4,917,613
- Issue date Apr 17, 1990
- Intel Corporation
- Ashok N. Kabadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density flexible circuit connector
- Patent number 4,850,883
- Issue date Jul 25, 1989
- Intel Corporation
- Ashok N. Kabadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density flexible circuit
- Patent number 4,798,918
- Issue date Jan 17, 1989
- Intel Corporation
- Ashok N. Kabadi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TEST, VALIDATION, AND DEBUG ARCHITECTURE
- Publication number 20150127983
- Publication date May 7, 2015
- Intel Corporation
- Mark B. Trobough
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Low profile and tight pad-pitch land-grid-array (LGA) socket
- Publication number 20060091538
- Publication date May 4, 2006
- Ashok N. Kabadi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Hybrid compression socket connector for integrated circuits
- Publication number 20060067041
- Publication date Mar 30, 2006
- Ashok N. Kabadi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARIABLE DENSITY GRAPHITE FOAM HEAT SINK
- Publication number 20050088823
- Publication date Apr 28, 2005
- Ashok N. Kabadi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Socketable IC package and associated methods
- Publication number 20030168738
- Publication date Sep 11, 2003
- Intel Corporation
- Ashok N. Kabadi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Ashok N. Kabadi

Person

Patents Grantslast 30 patents

Test, validation, and debug architecture

Removable package underside device attach

Hybrid compression socket connector for integrated circuits

Component array adapter

Parallel-plate/pin-fin hybrid copper heat sink for cooling high-pow...

Direct BGA socket

Interconnection device for connecting test equipment with a circuit...

Interconnection device for connecting test equipment with a circuit...

High density connector system

High density connection system

High density flexible circuit connector

High density flexible circuit

Patents Applicationslast 30 patents

TEST, VALIDATION, AND DEBUG ARCHITECTURE

Low profile and tight pad-pitch land-grid-array (LGA) socket

Hybrid compression socket connector for integrated circuits

VARIABLE DENSITY GRAPHITE FOAM HEAT SINK

Socketable IC package and associated methods