Asri Yusof

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of using substrate with conductive...
- Patent number 9,368,423
- Issue date Jun 14, 2016
- STATS ChipPAC Pte. Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with leadframe and method of ma...
- Patent number 9,190,349
- Issue date Nov 17, 2015
- Stats Chippac Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless integrated circuit packaging system and method of manufact...
- Patent number 9,142,530
- Issue date Sep 22, 2015
- Stats Chippac Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with routable traces and method...
- Patent number 9,105,620
- Issue date Aug 11, 2015
- Stats Chippac Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with trenched leadframe and met...
- Patent number 8,937,379
- Issue date Jan 20, 2015
- Stats Chippac Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a package-on-package structure
- Patent number 7,901,988
- Issue date Mar 8, 2011
- EEMS Asia Pte Ltd
- Asri bin Yusof
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Using Substrate With Conductive...
- Publication number 20150001707
- Publication date Jan 1, 2015
- STATS ChipPAC, Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACT...
- Publication number 20140284791
- Publication date Sep 25, 2014
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A PACKAGE-ON-PACKAGE STRUCTURE
- Publication number 20100032847
- Publication date Feb 11, 2010
- Asri bin Yusof
- H01 - BASIC ELECTRIC ELEMENTS