Astitva TRIPATHI

Follow

Person

Mesa, AZ, US

People

Patents Applicationslast 30 patents

Information Patent Application
THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES
- Publication number 20250112163
- Publication date Apr 3, 2025
- Intel Corporation
- Pratyush Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANNEALED SHAPE MEMORY ALLOY ON A SUBSTRATE
- Publication number 20250112174
- Publication date Apr 3, 2025
- Intel Corporation
- Siddarth KUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES
- Publication number 20250112175
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
- Publication number 20250112136
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDU...
- Publication number 20250113434
- Publication date Apr 3, 2025
- Intel Corporation
- Bai NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS MITIGATION ARCHITECTURES FOR GLASS CORE SUBSTRATES
- Publication number 20250112140
- Publication date Apr 3, 2025
- Intel Corporation
- Rahul BHURE
- H01 - BASIC ELECTRIC ELEMENTS