Atsuhito Hayakawa

Person

Mie Prefecture, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Producing granular epoxy resin by refining and pulverizing solid ep...
- Patent number 7,491,774
- Issue date Feb 17, 2009
- Japan Epoxy Resins Co., Ltd.
- Yasuyuki Murata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy compound, preparation method thereof, and use thereof
- Patent number 7,307,128
- Issue date Dec 11, 2007
- Japan Epoxy Resins Co., Ltd.
- Atsuhito Hayakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy compound, preparation method thereof, and use thereof
- Patent number 7,304,120
- Issue date Dec 4, 2007
- Japan Epoxy Resins Co., Ltd.
- Atsuhito Hayakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Granular epoxy resin, production method thereof, and granular epoxy...
- Patent number 7,285,602
- Issue date Oct 23, 2007
- Japan Epoxy Resins Co., Ltd.
- Yasuyuki Murata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curing agent for epoxy resins and epoxy resin composition
- Patent number 6,881,799
- Issue date Apr 19, 2005
- Resolution Performance Products LLC
- Atsuhito Hayakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition for semiconductor encapsulation
- Patent number 6,255,365
- Issue date Jul 3, 2001
- Shell Oil Company
- Atsuhito Hayakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition and epoxy resin composition for encapsulati...
- Patent number 6,063,876
- Issue date May 16, 2000
- Shell Oil Company
- Atsuhito Hayakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition for semiconductor encapsulation
- Patent number 5,739,186
- Issue date Apr 14, 1998
- Shell Oil Company
- Atsuhito Hayakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Production of method of granular epoxy resin, and granular epoxy re...
- Publication number 20070135616
- Publication date Jun 14, 2007
- Japan Epoxy Resins Co., Ltd.
- Yasuyuki Murata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Epoxy compound, preparation method thereof, and use thereof
- Publication number 20070123684
- Publication date May 31, 2007
- Japan Epoxy Resins Co., Ltd.
- Atsuhito Hayakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Epoxy compound, preparation method thereof, and use thereof
- Publication number 20050069715
- Publication date Mar 31, 2005
- JAPAN EPOXY RESINS CO., LTD.
- Atsuhito Hayakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Granular epoxy resin, production method thereof, and granular epoxy...
- Publication number 20040202864
- Publication date Oct 14, 2004
- JAPAN EPOXY RESINS CO., LTD.
- Yasuyuki Murata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Curing agent for epoxy resins and epoxy resin composition
- Publication number 20040054119
- Publication date Mar 18, 2004
- Atsuhito Hayakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Epoxy resin composition for semiconductor encapsulation
- Publication number 20040048971
- Publication date Mar 11, 2004
- Atsuhito Hayakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Atsuhito Hayakawa

Person

Patents Grantslast 30 patents

Producing granular epoxy resin by refining and pulverizing solid ep...

Epoxy compound, preparation method thereof, and use thereof

Epoxy compound, preparation method thereof, and use thereof

Granular epoxy resin, production method thereof, and granular epoxy...

Curing agent for epoxy resins and epoxy resin composition

Epoxy resin composition for semiconductor encapsulation

Epoxy resin composition and epoxy resin composition for encapsulati...

Epoxy resin composition for semiconductor encapsulation

Patents Applicationslast 30 patents

Production of method of granular epoxy resin, and granular epoxy re...

Epoxy compound, preparation method thereof, and use thereof

Epoxy compound, preparation method thereof, and use thereof

Granular epoxy resin, production method thereof, and granular epoxy...

Curing agent for epoxy resins and epoxy resin composition

Epoxy resin composition for semiconductor encapsulation