Atsuhito Negoro

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Kyoto, JP

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Patents Grantslast 30 patents

Information Patent Grant
Leadframe for making semiconductor devices
- Patent number 5,466,968
- Issue date Nov 14, 1995
- Rohm Co. Ltd.
- Hiroshi Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip die bonding using a double-sided adhesive tape
- Patent number 5,411,921
- Issue date May 2, 1995
- Rohm Co., Ltd.
- Atsuhito Negoro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with deformable buffer portions
- Patent number 5,338,972
- Issue date Aug 16, 1994
- Rohm Co., Ltd.
- Atsuhito Negoro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame
- Patent number 5,304,841
- Issue date Apr 19, 1994
- Rohm Co., Ltd.
- Atsuhito Negoro
- H01 - BASIC ELECTRIC ELEMENTS