Atsuko Fujino

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and process for producing same
- Patent number 8,236,666
- Issue date Aug 7, 2012
- Mitsubishi Electric Corporation
- Seiki Hiramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat conductive sheet and method for producing same, and powder module
- Patent number 8,193,633
- Issue date Jun 5, 2012
- Mitsubishi Electric Corporation
- Kenji Mimura
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 7,514,782
- Issue date Apr 7, 2009
- Mitsubishi Electric Corporation
- Seiki Hiramatsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT CONDUCTIVE SHEET AND POWER MODULE
- Publication number 20100226095
- Publication date Sep 9, 2010
- Mitsubishi Electric Corporation
- Kenji Mimura
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCING SAME
- Publication number 20100201002
- Publication date Aug 12, 2010
- Mitsubishi Electric Corporation
- Seiki Hiramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20070241450
- Publication date Oct 18, 2007
- MITSUBISHI ELECTRIC CORPORATION
- Seiki Hiramatsu
- H01 - BASIC ELECTRIC ELEMENTS