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Atsuko Noda

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  • Amagasaki, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Moistureproof structure for module circuits
    • Patent number 5,276,414
    • Issue date Jan 4, 1994
    • Mitsubishi Denki Kabushiki Kaisha
    • Takamitsu Fujimoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Resin-sealed semiconductor device
    • Patent number 5,097,317
    • Issue date Mar 17, 1992
    • Mitsubishi Denki Kabushiki Kaisha
    • Takamitsu Fujimoto
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...