Atsuo Ikeda

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Saitama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding structure of bonding wire
- Patent number 9,331,049
- Issue date May 3, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bonding structure of multilayer copper bonding wire
- Patent number 8,836,147
- Issue date Sep 16, 2014
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper bonding wire for semiconductor device and bonding structure...
- Patent number 8,653,668
- Issue date Feb 18, 2014
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor mounting bonding wire
- Patent number 8,097,960
- Issue date Jan 17, 2012
- Nippon Steel Materials Co., Ltd.
- Shinichi Terashima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING STRUCTURE OF MULTILAYER COPPER BONDING WIRE
- Publication number 20130180757
- Publication date Jul 18, 2013
- Nippon Micrometal Corporation
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER BONDING WIRE FOR SEMICONDUCTOR AND BONDING STRUCTURE THEREOF
- Publication number 20120299182
- Publication date Nov 29, 2012
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING STRUCTURE OF BONDING WIRE
- Publication number 20110104510
- Publication date May 5, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MOUNTING BONDING WIRE
- Publication number 20090072399
- Publication date Mar 19, 2009
- Nippon Steel Materials Co., Ltd.
- Shinichi Terashima
- H01 - BASIC ELECTRIC ELEMENTS