Atsuo Uchiyama

Person

Kosyoku-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for slicing workpiece and workpiece holder
- Patent number 10,350,788
- Issue date Jul 16, 2019
- Shin-Etsu Handotai Co., Ltd.
- Atsuo Uchiyama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of resuming operation of wire saw
- Patent number 9,662,805
- Issue date May 30, 2017
- Shin-Etsu Handotai Co., Ltd.
- Atsuo Uchiyama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Silicon wafer and a silicon epitaxial wafer having a polycrystal si...
- Patent number 9,163,327
- Issue date Oct 20, 2015
- Shin-Etsu Handotai Co., Ltd.
- Fumiaki Maruyama
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Wafer and epitaxial wafer, and manufacturing processes therefor
- Patent number 8,273,146
- Issue date Sep 25, 2012
- Shin-Etsu Handotai Co., Ltd.
- Fumiaki Maruyama
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Method of producing semiconductor substrate
- Patent number 5,395,788
- Issue date Mar 7, 1995
- Shin-Etsu Handotai Co., Ltd.
- Takao Abe
- G02 - OPTICS
Information Patent Grant
SOI semiconductor substrate
- Patent number 5,266,824
- Issue date Nov 30, 1993
- Shin-Etsu Handotai Co., Ltd.
- Takao Abe
- G02 - OPTICS
Information Patent Grant
Method for making uniform the thickness of a Si single crystal thin...
- Patent number 5,213,657
- Issue date May 25, 1993
- Shin-Etsu Handotai Kabushiki Kaisha
- Takao Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a substrate for semiconductor devices
- Patent number 5,152,857
- Issue date Oct 6, 1992
- Shin-Etsu Handotai Co., Ltd.
- Tatsuo Ito
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR SLICING WORKPIECE AND WORKPIECE HOLDER
- Publication number 20160303765
- Publication date Oct 20, 2016
- Shin-Etsu Handotai Co., Ltd.
- Atsuo UCHIYAMA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD OF RESUMING OPERATION OF WIRE SAW
- Publication number 20150328800
- Publication date Nov 19, 2015
- Shin-Etsu Handotai Co., Ltd.
- Atsuo UCHIYAMA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
WAFER AND EPITAXIAL WAFER, AND MANUFACTURING PROCESSES THEREFOR
- Publication number 20120298995
- Publication date Nov 29, 2012
- Shin-Etsu Handotai Co., Ltd.
- Fumiaki Maruyama
- C30 - CRYSTAL GROWTH

Atsuo Uchiyama

Person

Patents Grantslast 30 patents

Method for slicing workpiece and workpiece holder

Method of resuming operation of wire saw

Silicon wafer and a silicon epitaxial wafer having a polycrystal si...

Wafer and epitaxial wafer, and manufacturing processes therefor

Method of producing semiconductor substrate

SOI semiconductor substrate

Method for making uniform the thickness of a Si single crystal thin...

Method for preparing a substrate for semiconductor devices

Patents Applicationslast 30 patents

METHOD FOR SLICING WORKPIECE AND WORKPIECE HOLDER

METHOD OF RESUMING OPERATION OF WIRE SAW

WAFER AND EPITAXIAL WAFER, AND MANUFACTURING PROCESSES THEREFOR