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Atsushi Fujii

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  • Osaka-shi, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Sealing material for thin plate member
    • Patent number 9,077,010
    • Issue date Jul 7, 2015
    • Nippon Valqua Industries, Ltd.
    • Akira Ueda
    • F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...

Patents Applicationslast 30 patents

  • Information Patent Application

    Sealing Material for Thin Plate Member
    • Publication number 20130307227
    • Publication date Nov 21, 2013
    • NIPPON VALQUA INDUSTRIES, LTD.
    • Akira Ueda
    • H01 - BASIC ELECTRIC ELEMENTS