TREA

Atsushi Fukushima

Follow

Person

  • Ibaraki, JP
People

Patents Grantslast 30 patents

  • Information Patent Grant

    High-purity copper-chromium alloy sputtering target
    • Patent number 10,297,429
    • Issue date May 21, 2019
    • JX Nippon Mining & Metals Corporation
    • Tomio Otsuki
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Tantalum sputtering target
    • Patent number 10,266,924
    • Issue date Apr 23, 2019
    • JX Nippon Mining & Metals Corporation
    • Atsushi Fukushima
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Tantalum sputtering target
    • Patent number 9,845,528
    • Issue date Dec 19, 2017
    • JX Nippon Mining & Metals Corporation
    • Atsushi Fukushima
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Sputtering target and manufacturing method therefor
    • Patent number 9,704,695
    • Issue date Jul 11, 2017
    • JX Nippon Mining & Metals Corporation
    • Kenichi Nagata
    • B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
  • Information Patent Grant

    Titanium target for sputtering
    • Patent number 9,666,418
    • Issue date May 30, 2017
    • JX Nippon Mining & Metals Corporation
    • Shiro Tsukamoto
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    High purity copper and method of producing high purity copper based...
    • Patent number 9,476,134
    • Issue date Oct 25, 2016
    • JX Nippon Mining & Metals Corporation
    • Yuichiro Shindo
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    High-purity copper or high-purity copper alloy sputtering target, p...
    • Patent number 9,441,289
    • Issue date Sep 13, 2016
    • JX Nippon Mining & Metals Corporation
    • Atsushi Fukushima
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    High purity copper—manganese alloy sputtering target
    • Patent number 9,165,750
    • Issue date Oct 20, 2015
    • JX Nippon Mining & Metals Corporation
    • Kenichi Nagata
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    High-purity copper-manganese-alloy sputtering target
    • Patent number 9,090,970
    • Issue date Jul 28, 2015
    • JX Nippon Mining & Metals Corporation
    • Kenichi Nagata
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Tantalum sputtering target
    • Patent number 9,085,819
    • Issue date Jul 21, 2015
    • JX Nippon Mining & Metals Corporation
    • Shinichiro Senda
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Pot-shaped copper sputtering target and manufacturing method thereof
    • Patent number 8,728,255
    • Issue date May 20, 2014
    • JX Nippon Mining & Metals Corporation
    • Atsushi Fukushima
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Sputtering target
    • Patent number 8,425,696
    • Issue date Apr 23, 2013
    • JX Nippon Mining & Metals Corporation
    • Kunihiro Oda
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Sputtering target/backing plate bonded body
    • Patent number 8,157,973
    • Issue date Apr 17, 2012
    • JX Nippon Mining & Metals Corporation
    • Kunihiro Oda
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

  • Information Patent Application

    HIGH-PURITY COPPER-CHROMIUM ALLOY SPUTTERING TARGET
    • Publication number 20140360869
    • Publication date Dec 11, 2014
    • Tomio Otsuki
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    SPUTTERING TARGET AND MANUFACTURING METHOD THEREFOR
    • Publication number 20140318953
    • Publication date Oct 30, 2014
    • JX NIPPON MINING & METALS CORPORATION
    • Kenichi Nagata
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    High Purity Copper-Manganese Alloy Sputtering Target
    • Publication number 20140284211
    • Publication date Sep 25, 2014
    • Kenichi Nagata
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    TITANIUM TARGET FOR SPUTTERING
    • Publication number 20140251802
    • Publication date Sep 11, 2014
    • JX NIPPON MINING & METALS CORPORATION
    • Shiro Tsukamoto
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    HIGH-PURITY COPPER-MANGANESE-ALLOY SPUTTERING TARGET
    • Publication number 20140158532
    • Publication date Jun 12, 2014
    • JX NIPPON MINING & METALS CORPORATION
    • Kenichi Nagata
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Copper-Titanium Alloy Sputtering Target, Semiconductor Wiring Line...
    • Publication number 20140110849
    • Publication date Apr 24, 2014
    • JX NIPPON MINING & METALS CORPORATION
    • Tomio Otsuki
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    High-Purity Copper-Manganese-Alloy Sputtering Target
    • Publication number 20140097084
    • Publication date Apr 10, 2014
    • JX NIPPON MINING & METALS CORPORATION
    • Kenichi Nagata
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    High Purity Copper and Method of Producing High Purity Copper Based...
    • Publication number 20130302205
    • Publication date Nov 14, 2013
    • JX NIPPON MINING & METALS CORPORATION
    • Yuichiro Shindo
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Tantalum Sputtering Target
    • Publication number 20130098759
    • Publication date Apr 25, 2013
    • JX NIPPON MINING & METALS CORPORATION
    • Shinichiro Senda
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Tantalum Sputtering Target
    • Publication number 20130092534
    • Publication date Apr 18, 2013
    • JX NIPPON MINING & METALS CORPORATION
    • Shinichiro Senda
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Tantalum Sputtering Target
    • Publication number 20120037501
    • Publication date Feb 16, 2012
    • JX NIPPON MINING & METALS CORPORATION
    • Atsushi Fukushima
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Tantalum Sputtering Target
    • Publication number 20120031756
    • Publication date Feb 9, 2012
    • JX NIPPON MINING & METALS CORPORATION
    • Atsushi Fukushima
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Tantalum Sputtering Target
    • Publication number 20110266145
    • Publication date Nov 3, 2011
    • JX NIPPON MINING & METALS CORPORATION
    • Atsushi Fukushima
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    High-Purity Copper or High-Purity Copper Alloy Sputtering Target, P...
    • Publication number 20110163447
    • Publication date Jul 7, 2011
    • JX NIPPON MINING & METALS CORPORATION
    • Atsushi Fukushima
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    High Purity Copper and Method of Producing High Purity Copper Based...
    • Publication number 20110123389
    • Publication date May 26, 2011
    • JX NIPPON MINING & METALS CORPORATION
    • Yuichiro Shindo
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Sputtering Target/Backing Plate Bonded Body
    • Publication number 20090277788
    • Publication date Nov 12, 2009
    • Nippon Mining & Metals Co., Ltd.
    • Kunihiro Oda
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Sputtering Target
    • Publication number 20090134021
    • Publication date May 28, 2009
    • Nippon Mining & Metals Co., Ltd.
    • Kunihiro Oda
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Pot-Shaped Copper Sputtering Target and Manufacturing Method Thereof
    • Publication number 20090057139
    • Publication date Mar 5, 2009
    • Nippon Mining & Metals Co., Ltd.
    • Atsushi Fukushima
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...