Atsushi Iijima

Person

Hong Kong, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Thin-film piezoelectric actuator
- Patent number 11,292,255
- Issue date Apr 5, 2022
- Sae Magnetics (H.K.) Ltd.
- Wei Xiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film piezoelectric material substrate, thin-film piezoelectric...
- Patent number 11,295,770
- Issue date Apr 5, 2022
- Sae Magnetics (H.K.) Ltd.
- Wei Xiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film piezoelectric material substrate, thin-film piezoelectric...
- Patent number 10,276,196
- Issue date Apr 30, 2019
- Sae Magnetics (H.K.) Ltd.
- Wei Xiong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thin film piezoelectric element and manufacturing method thereof
- Patent number 10,181,557
- Issue date Jan 15, 2019
- Sae Magnetics (H.K.) Ltd.
- Wei Xiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic head for perpendicular magnetic recording that includes a...
- Patent number 9,773,514
- Issue date Sep 26, 2017
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Thin-film piezoelectric material element, head gimbal assembly and...
- Patent number 9,722,169
- Issue date Aug 1, 2017
- Sae Magnetics (H.K.) Ltd.
- Wei Xiong
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory device, laminated semiconductor substrate and method of manu...
- Patent number 9,685,424
- Issue date Jun 20, 2017
- Sae Magnetics (H.K.) Ltd.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film piezoelectric material element, head gimbal assembly and...
- Patent number 9,646,637
- Issue date May 9, 2017
- Sae Magnetics (H.K.) Ltd.
- Wei Xiong
- G11 - INFORMATION STORAGE
Information Patent Grant
Thin film piezoelectric element and manufacturing method thereof, m...
- Patent number 9,450,171
- Issue date Sep 20, 2016
- Sae Magnetics (H.K.) Ltd.
- Wei Xiong
- G11 - INFORMATION STORAGE
Information Patent Grant
Thin-film magnetic head, method of manufacturing the same, head gim...
- Patent number 8,922,948
- Issue date Dec 30, 2014
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Manufacturing method for layered chip packages
- Patent number 8,912,042
- Issue date Dec 16, 2014
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic head for perpendicular magnetic recording having a main po...
- Patent number 8,896,967
- Issue date Nov 25, 2014
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Magnetic head for perpendicular magnetic recording having a main po...
- Patent number 8,867,169
- Issue date Oct 21, 2014
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Surface acoustic wave device
- Patent number 8,829,762
- Issue date Sep 9, 2014
- Sae Magnetics (H.K.) Ltd.
- Masahiro Nakano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Thin-film magnetic head with improved wide area track erasure (WATE...
- Patent number 8,824,102
- Issue date Sep 2, 2014
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Magnetic head for perpendicular magnetic recording with shield arou...
- Patent number 8,749,919
- Issue date Jun 10, 2014
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory device, laminated semiconductor substrate and method of manu...
- Patent number 8,659,166
- Issue date Feb 25, 2014
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered chip package and method of manufacturing same
- Patent number 8,653,639
- Issue date Feb 18, 2014
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing layered chip package
- Patent number 8,652,877
- Issue date Feb 18, 2014
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered chip package and method of manufacturing same
- Patent number 8,618,646
- Issue date Dec 31, 2013
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing layered chip package
- Patent number 8,587,125
- Issue date Nov 19, 2013
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film magnetic head, method of manufacturing the same, head gim...
- Patent number 8,576,514
- Issue date Nov 5, 2013
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Laminated semiconductor substrate, semiconductor substrate, laminat...
- Patent number 8,552,534
- Issue date Oct 8, 2013
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered chip package and method of manufacturing same
- Patent number 8,541,887
- Issue date Sep 24, 2013
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated chips package, semiconductor substrate and method of manu...
- Patent number 8,525,167
- Issue date Sep 3, 2013
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Perpendicular magnetic recording head including a front shield part...
- Patent number 8,514,520
- Issue date Aug 20, 2013
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Thin-film magnetic head, method of manufacturing the same, head gim...
- Patent number 8,514,516
- Issue date Aug 20, 2013
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of manufacturing a thin-film magnetic head
- Patent number 8,499,435
- Issue date Aug 6, 2013
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Magnetic head for perpendicular magnetic recording that includes a...
- Patent number 8,498,080
- Issue date Jul 30, 2013
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Magnetic head for perpendicular magnetic recording with shield arou...
- Patent number 8,493,687
- Issue date Jul 23, 2013
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
THIN-FILM PIEZOELECTRIC MATERIAL ELEMENT
- Publication number 20220180896
- Publication date Jun 9, 2022
- SAE MAGNETICS (H. K) LTD.
- Wei XIONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THIN-FILM PIEZOELECTRIC ACTUATOR
- Publication number 20200189279
- Publication date Jun 18, 2020
- SAE MAGNETICS (H. K) LTD.
- Wei XIONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM PIEZOELECTRIC MATERIAL SUBSTRATE, THIN-FILM PIEZOELECTRIC...
- Publication number 20190279670
- Publication date Sep 12, 2019
- SAE MAGNETICS (H. K) LTD.
- Wei XIONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THIN FILM PIEZOELECTRIC ELEMENT AND MANUFACTURING METHOD THEREOF
- Publication number 20170317267
- Publication date Nov 2, 2017
- SAE MAGNETICS (H. K) LTD.
- Wei XIONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM PIEZOELECTRIC MATERIAL ELEMENT, HEAD GIMBAL ASSEMBLY AND...
- Publication number 20170207383
- Publication date Jul 20, 2017
- SAE MAGNETICS (H. K) LTD.
- Wei XIONG
- G11 - INFORMATION STORAGE
Information Patent Application
THIN-FILM PIEZOELECTRIC MATERIAL ELEMENT, HEAD GIMBAL ASSEMBLY AND...
- Publication number 20170133045
- Publication date May 11, 2017
- SAE MAGNETICS (H. K) LTD.
- Wei XIONG
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE, LAMINATED SEMICONDUCTOR SUBSTRATE AND METHOD OF MANU...
- Publication number 20140124959
- Publication date May 8, 2014
- SAE Magnetics (H.K.) Ltd.
- Yoshitaka SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR LAYERED CHIP PACKAGES
- Publication number 20140080259
- Publication date Mar 20, 2014
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A MAIN PO...
- Publication number 20130308227
- Publication date Nov 21, 2013
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka SASAKI
- G11 - INFORMATION STORAGE
Information Patent Application
THIN FILM PIEZOELECTRIC ELEMENT AND MANUFACTURING METHOD THEREOF, M...
- Publication number 20130279042
- Publication date Oct 24, 2013
- SAE MAGNETICS (H. K) LTD.
- Wei XIONG
- G11 - INFORMATION STORAGE
Information Patent Application
THIN FILM PIEZOELECTRIC ELEMENT AND MANUFACTURING METHOD THEREOF, M...
- Publication number 20130279044
- Publication date Oct 24, 2013
- SAE MAGNETICS (H. K) LTD.
- Wei XIONG
- G11 - INFORMATION STORAGE
Information Patent Application
COMBINATION FOR COMPOSITE LAYERED CHIP PACKAGE
- Publication number 20130241081
- Publication date Sep 19, 2013
- SAE MAGNETICS (H. K) LTD.
- Yoshitaka SASAKI
- G11 - INFORMATION STORAGE
Information Patent Application
THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIM...
- Publication number 20130176644
- Publication date Jul 11, 2013
- SAE MAGNETICS (H. K) LTD.
- Yoshitaka SASAKI
- G11 - INFORMATION STORAGE
Information Patent Application
THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIM...
- Publication number 20130155550
- Publication date Jun 20, 2013
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE
Information Patent Application
LAMINATED SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR SUBSTRATE, LAMINAT...
- Publication number 20130105949
- Publication date May 2, 2013
- SAE MAGNETICS (H. K) LTD.
- Yoshitaka SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE LAYERED CHIP PACKAGE
- Publication number 20130075935
- Publication date Mar 28, 2013
- SAE MAGNETICS (H.K.) LTD.
- Yoshitaka SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A MAIN PO...
- Publication number 20130038966
- Publication date Feb 14, 2013
- SAE MAGNETICS (H.K.) LTD.
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE
Information Patent Application
COMPOSITE LAYERED CHIP PACKAGE
- Publication number 20130020723
- Publication date Jan 24, 2013
- SAE MAGNETICS (H. K) LTD.
- Yoshitaka SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20120313260
- Publication date Dec 13, 2012
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A MAIN PO...
- Publication number 20120314323
- Publication date Dec 13, 2012
- SAE MAGNETICS (H.K.) LTD.
- Yoshitaka SASAKI
Information Patent Application
LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20120313259
- Publication date Dec 13, 2012
- SAE Magnetics (H.K.) Ltd.
- Yoshitaka SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIM...
- Publication number 20120282492
- Publication date Nov 8, 2012
- SAE MAGNETICS (H. K) LTD.
- Yoshitaka SASAKI
- G11 - INFORMATION STORAGE
Information Patent Application
MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A MAIN PO...
- Publication number 20120257304
- Publication date Oct 11, 2012
- SAE MAGNETICS (H. K) LTD.
- Yoshitaka SASAKI
- G11 - INFORMATION STORAGE
Information Patent Application
LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20120256321
- Publication date Oct 11, 2012
- SAE MAGNETICS (H.K.) LTD.
- Yoshitaka SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING THAT INCLUDES A...
- Publication number 20120218663
- Publication date Aug 30, 2012
- SAE MAGNETICS (H. K) LTD.
- Yoshitaka SASAKI
- G11 - INFORMATION STORAGE
Information Patent Application
MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING THAT INCLUDES A...
- Publication number 20120218662
- Publication date Aug 30, 2012
- SAE MAGNETICS (H. K) LTD.
- Yoshitaka SASAKI
- G11 - INFORMATION STORAGE
Information Patent Application
LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120187575
- Publication date Jul 26, 2012
- SAE MAGNETICS (H. K) LTD.
- Yoshitaka SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A MAIN PO...
- Publication number 20120188666
- Publication date Jul 26, 2012
- SAE MAGNETICS (H. K) LTD.
- Yoshitaka SASAKI
- G11 - INFORMATION STORAGE
Information Patent Application
MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A MAIN PO...
- Publication number 20120170156
- Publication date Jul 5, 2012
- SAE MAGNETICS (H. K) LTD.
- Yoshitaka SASAKI
- G11 - INFORMATION STORAGE
Information Patent Application
THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIM...
- Publication number 20120170154
- Publication date Jul 5, 2012
- SAE MAGNETICS (H. K) LTD.
- Yoshitaka SASAKI
- G11 - INFORMATION STORAGE

Atsushi Iijima

Person

Patents Grantslast 30 patents

Thin-film piezoelectric actuator

Thin-film piezoelectric material substrate, thin-film piezoelectric...

Thin-film piezoelectric material substrate, thin-film piezoelectric...

Thin film piezoelectric element and manufacturing method thereof

Magnetic head for perpendicular magnetic recording that includes a...

Thin-film piezoelectric material element, head gimbal assembly and...

Memory device, laminated semiconductor substrate and method of manu...

Thin-film piezoelectric material element, head gimbal assembly and...

Thin film piezoelectric element and manufacturing method thereof, m...

Thin-film magnetic head, method of manufacturing the same, head gim...

Manufacturing method for layered chip packages

Magnetic head for perpendicular magnetic recording having a main po...

Magnetic head for perpendicular magnetic recording having a main po...

Surface acoustic wave device

Thin-film magnetic head with improved wide area track erasure (WATE...

Magnetic head for perpendicular magnetic recording with shield arou...

Memory device, laminated semiconductor substrate and method of manu...

Layered chip package and method of manufacturing same

Method of manufacturing layered chip package

Layered chip package and method of manufacturing same

Method of manufacturing layered chip package

Thin-film magnetic head, method of manufacturing the same, head gim...

Laminated semiconductor substrate, semiconductor substrate, laminat...

Layered chip package and method of manufacturing same

Laminated chips package, semiconductor substrate and method of manu...

Perpendicular magnetic recording head including a front shield part...

Thin-film magnetic head, method of manufacturing the same, head gim...

Method of manufacturing a thin-film magnetic head

Magnetic head for perpendicular magnetic recording that includes a...

Magnetic head for perpendicular magnetic recording with shield arou...

Patents Applicationslast 30 patents

THIN-FILM PIEZOELECTRIC MATERIAL ELEMENT

THIN-FILM PIEZOELECTRIC ACTUATOR

THIN-FILM PIEZOELECTRIC MATERIAL SUBSTRATE, THIN-FILM PIEZOELECTRIC...

THIN FILM PIEZOELECTRIC ELEMENT AND MANUFACTURING METHOD THEREOF

THIN-FILM PIEZOELECTRIC MATERIAL ELEMENT, HEAD GIMBAL ASSEMBLY AND...

THIN-FILM PIEZOELECTRIC MATERIAL ELEMENT, HEAD GIMBAL ASSEMBLY AND...

MEMORY DEVICE, LAMINATED SEMICONDUCTOR SUBSTRATE AND METHOD OF MANU...

MANUFACTURING METHOD FOR LAYERED CHIP PACKAGES

MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A MAIN PO...

THIN FILM PIEZOELECTRIC ELEMENT AND MANUFACTURING METHOD THEREOF, M...

THIN FILM PIEZOELECTRIC ELEMENT AND MANUFACTURING METHOD THEREOF, M...

COMBINATION FOR COMPOSITE LAYERED CHIP PACKAGE

THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIM...

THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIM...

LAMINATED SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR SUBSTRATE, LAMINAT...

COMPOSITE LAYERED CHIP PACKAGE

MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A MAIN PO...

COMPOSITE LAYERED CHIP PACKAGE

LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME

MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A MAIN PO...

LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME

THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIM...

MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A MAIN PO...

LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME

MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING THAT INCLUDES A...

MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING THAT INCLUDES A...

LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A MAIN PO...

MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A MAIN PO...

THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIM...