Atsushi Ikari

Person

Tokuyama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing ring-shaped member and ring-shaped member
- Patent number 11,551,915
- Issue date Jan 10, 2023
- THINKON NEW TECHNOLOGY JAPAN CORPORATION
- Atsushi Ikari
- C30 - CRYSTAL GROWTH
Information Patent Grant
Protective material ring
- Patent number 11,545,345
- Issue date Jan 3, 2023
- THINKON NEW TECHNOLOGY JAPAN CORPORATION
- Atsushi Ikari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ring for electrode
- Patent number 11,380,525
- Issue date Jul 5, 2022
- THINKON NEW TECHNOLOGY JAPAN CORPORATION
- Atsushi Ikari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode ring
- Patent number 11,348,764
- Issue date May 31, 2022
- THINKON NEW TECHNOLOGY JAPAN CORPORATION
- Atsushi Ikari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing ring-shaped member and ring-shaped member
- Patent number 10,984,988
- Issue date Apr 20, 2021
- THINKON NEW TECHNOLOGY JAPAN CORPORATION
- Atsushi Ikari
- C30 - CRYSTAL GROWTH
Information Patent Grant
Electrode Plate
- Patent number 10,580,621
- Issue date Mar 3, 2020
- THINKON NEW TECHNOLOGY JAPAN CORPORATION
- Atsushi Ikari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ring-shaped electrode
- Patent number 10,553,405
- Issue date Feb 4, 2020
- THINKON NEW TECHNOLOGY JAPAN CORPORATION
- Atsushi Ikari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon wafer and method for producing the same
- Patent number 8,524,001
- Issue date Sep 3, 2013
- Siltronic AG
- Katsuhiko Nakai
- C30 - CRYSTAL GROWTH
Information Patent Grant
Epitaxial wafer and production method thereof
- Patent number 8,241,421
- Issue date Aug 14, 2012
- Siltronic AG
- Katsuhiko Nakai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor substrate and method for production thereof
- Patent number 8,043,929
- Issue date Oct 25, 2011
- Siltronic AG
- Josef Brunner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing p-doped and epitaxially coated semiconductor...
- Patent number 7,470,323
- Issue date Dec 30, 2008
- Siltronic AG
- Wilfried von Ammon
- C30 - CRYSTAL GROWTH
Information Patent Grant
Silicon semiconductor substrate and preparation thereof
- Patent number 7,208,043
- Issue date Apr 24, 2007
- Siltronic AG
- Akiyoshi Tachikawa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer holding, wafer support member, wafer boat and heat treatment...
- Patent number 7,204,887
- Issue date Apr 17, 2007
- Nippon Steel Corporation
- Keisuke Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon semiconductor substrate and process for producing the same
- Patent number 6,805,742
- Issue date Oct 19, 2004
- Siltronic AG
- Akiyoshi Tachikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI substrate and method for production thereof
- Patent number 6,617,034
- Issue date Sep 9, 2003
- Nippon Steel Corporation
- Isao Hamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon semiconductor wafer and method for producing the same
- Patent number 6,548,886
- Issue date Apr 15, 2003
- Wacker NSCE Corporation
- Atsushi Ikari
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING RING-SHAPED MEMBER AND RING-SHAPED MEMBER
- Publication number 20210225617
- Publication date Jul 22, 2021
- THINKON NEW TECHNOLOGY JAPAN CORPORATION
- Atsushi Ikari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE MATERIAL RING
- Publication number 20200365376
- Publication date Nov 19, 2020
- THINKON NEW TECHNOLOGY JAPAN CORPORATION
- Atsushi Ikari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE RING
- Publication number 20200194237
- Publication date Jun 18, 2020
- THINKON NEW TECHNOLOGY JAPAN CORPORATION
- Atsushi Ikari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING RING-SHAPED MEMBER AND RING-SHAPED MEMBER
- Publication number 20190259581
- Publication date Aug 22, 2019
- THINKON NEW TECHNOLOGY JAPAN CORPORATION
- Atsushi Ikari
- C30 - CRYSTAL GROWTH
Information Patent Application
ELECTRODE PLATE
- Publication number 20190172682
- Publication date Jun 6, 2019
- THINKON NEW TECHNOLOGY JAPAN CORPORATION
- Atsushi Ikari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RING-SHAPED ELECTRODE
- Publication number 20190172687
- Publication date Jun 6, 2019
- THINKON NEW TECHNOLOGY JAPAN CORPORATION
- Atsushi Ikari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RING FOR ELECTRODE
- Publication number 20190164728
- Publication date May 30, 2019
- THINKON NEW TECHNOLOGY JAPAN CORPORATION
- Atsushi Ikari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Epitaxial Wafer and Production Method Thereof
- Publication number 20110084366
- Publication date Apr 14, 2011
- Siltronic AG
- Katsuhiko Nakai
- C30 - CRYSTAL GROWTH
Information Patent Application
Silicon wafer and method for producing the same
- Publication number 20100164071
- Publication date Jul 1, 2010
- Siltronic AG
- Katsuhiko Nakai
- C30 - CRYSTAL GROWTH
Information Patent Application
Semiconductor Substrate And Method For Production Thereof
- Publication number 20080268613
- Publication date Oct 30, 2008
- Siltronic AG
- Josef Brunner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process For Producing P-Doped and Epitaxially Coated Semiconductor...
- Publication number 20080096371
- Publication date Apr 24, 2008
- Siltronic AG
- Wilfried von Ammon
- C30 - CRYSTAL GROWTH
Information Patent Application
Semiconductor substrate and method for production thereof
- Publication number 20050139961
- Publication date Jun 30, 2005
- Siltronic AG
- Josef Brunner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon semiconductor substrate and process for producing the same
- Publication number 20030079674
- Publication date May 1, 2003
- WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AG
- Akiyoshi Tachikawa
- C30 - CRYSTAL GROWTH
Information Patent Application
Silicon semiconductor substrate and preparation thereof
- Publication number 20030056715
- Publication date Mar 27, 2003
- WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AG
- Akiyoshi Tachikawa
- C30 - CRYSTAL GROWTH
Information Patent Application
Wafer holder, wafer support member, wafer holding device, and heat...
- Publication number 20030029570
- Publication date Feb 13, 2003
- Keisuke Kawamura
- H01 - BASIC ELECTRIC ELEMENTS

Atsushi Ikari

Person

Patents Grantslast 30 patents

Method of manufacturing ring-shaped member and ring-shaped member

Protective material ring

Ring for electrode

Electrode ring

Method of manufacturing ring-shaped member and ring-shaped member

Electrode Plate

Ring-shaped electrode

Silicon wafer and method for producing the same

Epitaxial wafer and production method thereof

Semiconductor substrate and method for production thereof

Process for producing p-doped and epitaxially coated semiconductor...

Silicon semiconductor substrate and preparation thereof

Wafer holding, wafer support member, wafer boat and heat treatment...

Silicon semiconductor substrate and process for producing the same

SOI substrate and method for production thereof

Silicon semiconductor wafer and method for producing the same

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING RING-SHAPED MEMBER AND RING-SHAPED MEMBER

PROTECTIVE MATERIAL RING

ELECTRODE RING

METHOD OF MANUFACTURING RING-SHAPED MEMBER AND RING-SHAPED MEMBER

ELECTRODE PLATE

RING-SHAPED ELECTRODE

RING FOR ELECTRODE

Epitaxial Wafer and Production Method Thereof

Silicon wafer and method for producing the same

Semiconductor Substrate And Method For Production Thereof

Process For Producing P-Doped and Epitaxially Coated Semiconductor...

Semiconductor substrate and method for production thereof

Silicon semiconductor substrate and process for producing the same

Silicon semiconductor substrate and preparation thereof

Wafer holder, wafer support member, wafer holding device, and heat...